CAV24C32YE-GT3 ON Semiconductor, CAV24C32YE-GT3 Datasheet
CAV24C32YE-GT3
Specifications of CAV24C32YE-GT3
Related parts for CAV24C32YE-GT3
CAV24C32YE-GT3 Summary of contents
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... CAV24C32 2 32- CMOS Serial EEPROM Description The CAV24C32 is a 32−Kb CMOS Serial EEPROM devices, internally organized as 4096 words of 8 bits each. It features a 32−byte page write buffer and supports the Standard 2 (100 kHz) and Fast (400 kHz protocol. External address pins make it possible to address up to eight CAV24C32 devices on the same bus ...
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C32F AYMXXX G C32F = Specific Device Code A = Assembly Location Y = Production Year (Last Digit Production Month (1- XXX = Last Three Digits of Assembly Lot Number G = Pb−Free Package ...
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Table 4. PIN IMPEDANCE CHARACTERISTICS Symbol Parameter C (Note 4) SDA I/O Pin Capacitance IN C (Note 4) Input Capacitance (other pins (Note 5) WP Input Current WP I (Note 5) Address Input Current A (A0, A1, A2) ...
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Power-On Reset (POR) Each CAV24C32 incorporates Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after V exceeds the POR trigger level and will CC ...
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BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START t F SCL t SU:STA SDA IN SDA OUT Byte Write To write data to memory, the Master creates a START condition on the ...
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S BUS ACTIVITY SLAVE R MASTER ADDRESS T S SLAVE *a − a are don’t care bits 15 12 SCL SDA 8th Bit Byte n BUS ACTIVITY SLAVE ADDRESS MASTER R ADDRESS BYTE T S ...
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Immediate Read To read data from memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to ‘1’. The Slave responds with ACK and starts shifting out data residing ...
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PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O SYMBOL ...
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E1 e TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O SYMBOL MIN A A1 0.05 A2 ...
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... The device used in the above example is a CAV24C32WE−GT3 (SOIC, Automotive Temperature, NiPdAu, Tape & Reel, 3,000/Reel). 12. For other package options, please contact your nearest ON Semiconductor Sales office. 13. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...