CAT24C02ZI-G ON Semiconductor, CAT24C02ZI-G Datasheet - Page 15
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CAT24C02ZI-G
Manufacturer Part Number
CAT24C02ZI-G
Description
EEPROM 2K-Bit I2C Serial
Manufacturer
ON Semiconductor
Datasheet
1.CAT24C02ZI-G.pdf
(21 pages)
Specifications of CAT24C02ZI-G
Product Category
EEPROM
Rohs
yes
Memory Size
2 Kbit
Organization
256 x 8
Data Retention
100 yr
Maximum Clock Frequency
0.4 MHz
Maximum Operating Current
2 mA
Operating Supply Voltage
1.8 V , 2.5 V , 3.3 V , 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
MSOP
Access Time
900 ns
Interface Type
I2C
Minimum Operating Temperature
- 40 C
Supply Voltage - Max
5.5 V
Supply Voltage - Min
1.7 V
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
D
SEATING
PLANE
5X
0.20
C A B
0.039
PACKAGE DIMENSIONS
1.0
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
J
K
ISSUE H
TSOP−5
15
DETAIL Z
0.074
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
A
B
C
D
G
H
K
M
J
L
S
inches
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_