LCMXO2-4000HE-6MG132C Lattice, LCMXO2-4000HE-6MG132C Datasheet - Page 29
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LCMXO2-4000HE-6MG132C
Manufacturer Part Number
LCMXO2-4000HE-6MG132C
Description
FPGA - Field Programmable Gate Array 4320 LUTs 105 IO 1.2V 6 Spd
Manufacturer
Lattice
Datasheet
1.LCMXO2280E-4BN256C.pdf
(30 pages)
Specifications of LCMXO2-4000HE-6MG132C
Rohs
yes
Maximum Operating Frequency
133 MHz
Operating Supply Voltage
1.2 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Package / Case
BGA-132
Minimum Operating Temperature
0 C
Operating Supply Current
128 uA
Factory Pack Quantity
360
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LCMXO2-4000HE-6MG132C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Package Attributes /
Assembly Sites
Die Family (Product
Line)
Fabrication Process
Technology
Package Assembly
Site
Package Type
Ball/Lead Counts
Die Preparation /
Singulation
Die Attach Material
Mold Compound
Supplier/ID
Wire Bond Material
Wire Bond Methods
Substrate Material or
Lead Frame
Lead Finish Plating or
BGA Ball
Marking
Table 7.1: MachXO2 Package Assembly Data – BGA & TQFP
INDEX Return
7.0 MachXO2 ADDITIONAL FAMILY DATA
Kaohsiung, Taiwan
wafer saw / full cut
Hitachi EN-4900F
Thermosonic Ball
65nm CMOS
EME-G631H
(CS200FL)
Sumitomo
Gold (Au)
LCMXO2
CU C194
Matte Sn
ASEKH
Laser
QFN
32
CEL9750ZHF10ALKU
wafer saw / full cut
Thermosonic Ball
Ablebond 2100A
256/332 & 256
ucBGA, csBGA,
caBGA & ftBGA
HL83X Series
Bismaleimide
65nm CMOS
64, 132, 184,
respectively
(CS200FL)
Gold (Au)
LCMXO2
Malaysia
SAC305
Triazine
Hitachi
ASEM
Laser
29
wafer saw / full cut
Lattice Semiconductor Corporation Doc. #25-106923 Rev. F
Thermosonic Ball
Ablebond 3230
CEL9510HF10
65nm CMOS
(CS200FL)
100 & 144
Gold (Au)
LCMXO2
Matte Sn
Malaysia
Hitachi
ASEM
TQFP
Laser
n/a
wafer saw / full cut
Thermosonic Ball
Ablebond 2100A
9750HF10AKLU
HL83X Series
Bismaleimide
65nm CMOS
(CS200FL)
Gold (Au)
LCMXO2
Malaysia
SAC305
Triazine
fpBGA
Hitachi
ASEM
Laser
484