LFE3-35EA-8LFTN256I Lattice, LFE3-35EA-8LFTN256I Datasheet - Page 44
LFE3-35EA-8LFTN256I
Manufacturer Part Number
LFE3-35EA-8LFTN256I
Description
FPGA - Field Programmable Gate Array 33.3K LUTs 133 I/O 1.2V -8 SPEED
Manufacturer
Lattice
Datasheet
1.LFE3-95EA-7LFN672I.pdf
(141 pages)
Specifications of LFE3-35EA-8LFTN256I
Rohs
yes
Factory Pack Quantity
90
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFE3-35EA-8LFTN256I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Figure 2-38. LatticeECP3 Banks
LatticeECP3 devices contain two types of sysI/O buffer pairs.
1. Top (Bank 0 and Bank 1) and Bottom sysIO Buffer Pairs (Single-Ended Outputs Only)
The sysI/O buffer pairs in the top banks of the device consist of two single-ended output drivers and two sets of
single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also be con-
figured as a differential input. Only the top edge buffers have a programmable PCI clamp.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
The top and bottom sides are ideal for general purpose I/O, PCI, and inputs for LVDS (LVDS outputs are only
allowed on the left and right sides). The top side can be used for the DDR3 ADDR/CMD signals.
The I/O pins located on the top and bottom sides of the device are fully hot socketable.
V REF1(7)
V REF2(7)
V
V REF1(6)
V REF2(6)
V CCIO6
CCIO7
GND
GND
Bank 0
BOTTOM
SERDES
TOP
Quads
2-41
Bank 1
LatticeECP3 Family Data Sheet
V REF1(2)
V REF2(2)
V CCIO2
GND
V REF1(3)
V REF2(3)
V CCIO3
GND
Architecture
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