SST39SF512-70-4I-WHE Microchip Technology, SST39SF512-70-4I-WHE Datasheet - Page 21

• Manufacturer Part Number: SST39SF512-70-4I-WHE
• Description: Flash 64K X 8 70ns
• Manufacturer: Microchip Technology

Specifications of SST39SF512-70-4I-WHE

• Product Category: Flash
• Rohs: yes
• Memory Size: 512 Kbit
• Access Time: 70 ns
• Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSOP-32
• Organization: 64 KB x 8

512 Kbit Multi-Purpose Flash
SST39SF512
PACKAGING DIAGRAMS
©2003 Silicon Storage Technology, Inc.
32-
SST P
32-
SST P
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
Identifier
LEAD
LEAD
Optional
Pin #1
.595
.585
ACKAGE
ACKAGE
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
P
T
HIN
LASTIC
.553
.547
.048
.042
.042
.048
S
C
C
Note:
MALL
ODE
ODE
L
EAD
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
: NH
: WH
0.70
0.50
O
although some dimensions may be more stringent.
TOP VIEW
UTLINE
C
2
.495
.485
.453
.447
Pin # 1 Identifier
HIP
.050
BSC
1
32
C
P
ARRIER
ACKAGE
12.50
12.30
14.20
13.80
(PLCC)
(TSOP) 8
.032
.026
.050
BSC
.020 R.
MAX.
.029
.023
MM X
21
x 30˚
8.10
7.90
SIDE VIEW
14
max.
1.20
MM
.112
.106
.140
.125
.095
.075
.021
.013
.040
.030
.400
BSC
DETAIL
1.05
0.95
.015 Min.
1mm
R.
.530
.490
0.15
0.05
0.50
BSC
0.27
0.17
0.70
0.50
0˚- 5˚
BOTTOM VIEW
32-tsop-WH-7
.032
.026
S71149-05-000
32-plcc-NH-3
Data Sheet
11/03