FT200XD-R FTDI, FT200XD-R Datasheet - Page 38

• Manufacturer Part Number: FT200XD-R
• Description: USB Interface IC USB to I2C IC DFN-10
• Manufacturer: FTDI

Specifications of FT200XD-R

• Rohs: yes
• Product: USB 2.0
• Data Rate: 12 Mbps, 480 Mbps
• Interface Type: I2C, USB
• Operating Supply Voltage: 2.97 V to 5.5 V
• Operating Supply Current: 6.8 mA to 9.1 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: DFN-10
• Tradename: X-Chip

11.3 Solder Reflow Profile
The FT200XD is supplied in Pb free DFN-10 packages. The recommended solder reflow profile for the
package is shown in Figure 11.2.
Figure 11.2 FT200XD Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 11.1. Values are shown for
both a completely Pb free solder process (i.e. the FT200XD is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT200XD is used with non-Pb free solder).
Table 11.1 Reflow Profile Parameter Values
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
25
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
Copyright © 2013 Future Technology Devices International Limited
Min to t
(t
T = 25º C to T
T
Preheat
Time, t (seconds)
L
p
:
)
t
S
L
)
s
Max)
s
s
L
)
Min.)
Max.)
P
s
p
)
to T
Ramp Up
p
)
p
Pb Free Solder Process
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
FT200XD USB I2C SLAVE IC Datasheet
t
p
150°C
200°C
217°C
260°C
t
Document No.: FT_000628 Clearance No.: FTDI# 265
L
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
Non-Pb Free Solder Process
183°C 60 to 150 seconds
p
3°C / Second Max.
60 to 120 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
240°C
Version 1.3
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