MAX9209EUM+T Maxim Integrated, MAX9209EUM+T Datasheet - Page 2

• Manufacturer Part Number: MAX9209EUM+T
• Description: Serializers & Deserializers - Serdes
• Manufacturer: Maxim Integrated
• Type: Serializerr

Specifications of MAX9209EUM+T

• Data Rate: 1.785 Gbps
• Input Type: LVTTL/ LVCMOS
• Output Type: LVDS
• Number Of Inputs: 21
• Number Of Outputs: 3
• Operating Supply Voltage: 3 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: TSSOP-48
• Maximum Operating Temperature: + 85 C
• Maximum Power Dissipation: 1282 mW
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Current: 20 uA
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 3 V

ABSOLUTE MAXIMUM RATINGS
V
LVDS Outputs (TxOUT_, TxCLK OUT_) to GND ...-0.5V to +4.0V
5V Tolerant LVTTL/LVCMOS Inputs
(DCB/NC) to GND ......................................-0.5V to (V
LVDS Outputs (TxOUT_, TxCLK OUT_)
Continuous Power Dissipation (multilayer board, T
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Programmable DC-Balanced
21-Bit Serializers
DC ELECTRICAL CHARACTERISTICS
(V
= +3.3V, T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
SINGLE-ENDED INPUTS (TxIN_, TxCLK IN, PWRDWN, DCB/NC)
High-Level Input Voltage
Low-Level Input Voltage
Input Current
Input Clamp Voltage
LVDS OUTPUTS (TxOUT_, TxCLK OUT)
Differential Output Voltage
Change in V
Complementary Output States
Output Offset Voltage
Change in V
Complementary Output States
Output Short-Circuit Current
Magnitude of Differential Output
Short-Circuit Current
Differential Output Resistance
CC
CC
(TxIN_, TxCLK IN, PWRDWN) to GND ..............-0.5V to +6.0V
Short to GND and Differential Short .......................Continuous
48-Pin TSSOP (derate 16mW/°C above +70°C) ....... 1282mW
48-Pin TQFN (derate 40mW/°C above +70°C) ..........3200mW
_______________________________________________________________________________________
to GND ...........................................................-0.5V to +4.0V
= +3.0V to +3.6V, R
A
PARAMETER
= +25°C.) (Notes 1, 2)
OD
OS
Between
Between
L
= 100Ω ±1%, PWRDWN = high, DCB/NC = high or low, unless otherwise noted. Typical values are at V
SYMBOL
∆V
∆V
I
V
V
V
V
I
OSD
V
R
I
OS
OD
IN
CL
OS
IH
IL
OD
OS
O
A
TxIN_, TxCLK IN, PWRDWN
DCB/NC
V
I
Figure 1
Figure 1
Figure 1
Figure 1
V
non-DC-balanced mode
V
DC-balanced mode
V
(Note 3)
V
DC-balanced mode
Non-DC-balanced
mode
CL
IN
OUT+
OUT+
OD
OD
= +70°C)
CC
= hi g h or l ow , P WRDWN = hi g h or l ow
= -18mA
= 0V, non-DC-balanced mode
= 0V, DC-balanced mode (Note 3)
+ 0.5V)
or V
or V
OUT-
OUT-
CONDITIONS
= 0V or V
= 0V or V
ESD Protection
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Human Body Model (R
IEC 61000-4-2 (R
ISO 10605 (R
-40°C to +105°C
-40°C to +105°C
All Pins to GND..............................................................±2kV
Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....±8kV
Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..±15kV
Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....±8kV
Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..±25kV
CC,
CC
,
D
= 2kΩ, C
D
= 330Ω, C
D
1.125
S
MIN
-0.3
= 1.5kΩ, C
250
292
292
-20
-10
-15
2.0
2.0
78
78
= 330pF)
S
= 150pF)
TYP
1.25
±5.7
±8.2
-0.9
350
110
110
410
410
5.7
8.2
10
S
2
= 100pF)
V
1.375
MAX
+0.8
+20
-1.5
+10
+15
450
147
150
547
564
CC
5.5
0.3
25
30
10
15
+
UNITS
mV
mV
mV
mA
mA
µA
Ω
V
V
V
V
CC