FT311D-32Q1C-T FTDI, FT311D-32Q1C-T Datasheet - Page 29

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FT311D-32Q1C-T

Manufacturer Part Number
FT311D-32Q1C-T
Description
USB Interface IC USB Android Host Controller IC QFN-32
Manufacturer
FTDI
Datasheet

Specifications of FT311D-32Q1C-T

Rohs
yes
Product
USB 2.0
Interface Type
I2C, UART, USB
Operating Supply Voltage
0 V to 3.63 V
Operating Supply Current
25 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QFN-32

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FT311D-32Q1C-T
Manufacturer:
FTDI
Quantity:
101
9
FT311D is available in RoHS Compliant packages, QFN package (32QFN) and an LQFP package (32LQFP).
The packages are lead (Pb) free and use a „green‟ compound. The package is fully compliant with
European Union directive 2002/95/EC.
The mechanical drawings of the packages are shown in sections 9.2- all dimensions are in millimetres.
9.1 FT311D Package Markings
9.1.1 QFN-32
An example of the markings on the QFN package are shown in Figure 9-1. The FTDI part number is too
long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line.
32
1C should be printed on line 4, then a space and then the Date Code.
The solder reflow profile for all packages can be viewed in Section 9.3.
Figure 9-1 QFN Package Markings
1
Package Parameters
1.
2.
3.
4. All marking dimensions should be marked proportionally. Marking font should be using
YYWW = Date Code, where YY is year and WW is week number
Marking alignment should be centre justified
Laser Marking should be used
Unisem standard font (Roman Simplex)
XXXXXXXX
FT311D-32Q
1C YYWW
Copyright © 2012 Future Technology Devices International Limited
FTDI
II
DS
_FT311D
USB ANDROID HOST IC Datasheet
Document No.: FT_000660 Clearance No.: FTDI# 305
Line 2 – Wafer Lot Number
Line 3 – FTDI Part Number
Line 4 – Revision and Date
Code
Line 1 – FTDI Logo
Version 1.0
29

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