MAX3107ETG/V+ Maxim Integrated, MAX3107ETG/V+ Datasheet - Page 6

• Manufacturer Part Number: MAX3107ETG/V+
• Description: UART Interface IC UART
• Manufacturer: Maxim Integrated

Specifications of MAX3107ETG/V+

• Number Of Channels: 1
• Data Rate: 24 Mbps
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 1.71 V
• Supply Current: 4 mA

MAX3107
6
(Voltages referenced to AGND.)
V
V
RST, IRQ, DIN/A1, CS/A0, SCLK/SCL,
TX, RX, RTS/CLKOUT, CTS, GPIO_ ....... -0.3V to (V
DGND .................................................................. -0.3V to +0.3V
SPI/I
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
DC ELECTRICAL CHARACTERISTICS
(V
are at V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Digital Interface Supply Voltage
Analog Supply Voltage
UART Interface Logic Supply
Voltage
Logic Supply Voltage
CURRENT CONSUMPTION
V
V
V
V
V
V
in Shutdown Mode
L
18
DOUT/SDA, LDOEN, I
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
A
, V
A
A
A
L
EXT
18
, XOUT .................................................. -0.3V to (V
= +2.35V to +3.6V, V
Supply Current
Supply Current
Shutdown Supply Current
Sleep Supply Current
A
Input Power-Supply Current
, V
Supply Current
A
EXT
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
= +2.8V, V
PARAMETER
2
, XIN ................................................ -0.3V to +4.0V
C UART with 128-Word FIFOs
L
= +1.8V, V
2
C/SPI .................. -0.3V to (V
L
= +1.71V to +3.6V, V
EXT
SYMBOL
= +2.5V, T
I
I
I
A, SLEEP
A, SHDN
18SHDN
V
I
V
V
EXT
V
EXT
I
I
18
A
L
L
A
JC
) ............... 15NC/W
JA
) .......... 65NC/W
EXT
A
1.8MHz crystal oscillator active, PLL dis-
abled, V
Baud rate = 1Mbps, external clock, SPI
frequency is 8MHz, external loopback PLL
disabled, V
Shutdown mode, V
all inputs and outputs are idle
Sleep mode, V
inputs and outputs are idle
All logic inputs are at V
All logic inputs are at V
V
nal 1.85V voltage source), static power
consumption
= +25NC.) (Note 2)
LDOEN
EXT
= +1.71V to +3.6V, T
A
L
+ 0.3V)
+ 0.3V)
+ 0.3V)
LDOEN
= 0V (V
LDOEN
CONDITIONS
LDOEN
= V
18
L,
= V
LDOEN
is powered by an exter-
Continuous Power Dissipation (T
Operating Temperature Range ........................ -40NC to +85NC
Junction Temperature ................................................... +150NC
Storage Temperature Range ........................... -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
SSOP
SPI/I
TQFN (derate 15.4mW/NC above +70NC) ................. 1229mW
SSOP (derate 12.3mW/NC above +70NC) ................... 988mW
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
L
= V
L
L
A
(Note 3)
2
or V
or V
= -40NC to +85NC, unless otherwise noted. Typical values
L
C interface idle
= 0V, V
, V
EXT
EXT
RST
or 0V
or 0V
= V
RST
L,
= 0V,
all
1.71
2.35
1.71
1.65
MIN
A
= +70NC)
TYP
1.80
0.65
220
20
45
4
5
7
JC
) ............... 32NC/W
JA
MAX
1.95
500
100
3.6
3.6
3.6
1.3
35
15
10
50
) ...........81NC/W
Maxim Integrated
UNITS
mA
FA
FA
FA
FA
FA
FA
V
V
V
V