NB3H83905CDTG ON Semiconductor, NB3H83905CDTG Datasheet - Page 12
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NB3H83905CDTG
Manufacturer Part Number
NB3H83905CDTG
Description
Buffers & Line Drivers 1.8V/2.5V/3.3 V BUFFER
Manufacturer
ON Semiconductor
Datasheet
1.NB3H83905CDTG.pdf
(14 pages)
Specifications of NB3H83905CDTG
Product Category
Buffers & Line Drivers
Rohs
yes
Number Of Input Lines
1
Number Of Output Lines
6
Polarity
Non-Inverting
Supply Voltage - Max
3.465 V
Supply Voltage - Min
3.135 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-16
−T−
SEATING
PLANE
16
1
G
D
0.25 (0.010)
−A−
16 PL
M
*For additional information on our Pb−Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
9
8
K
B
−B−
S
0.58
16X
A
C
S
P
SOLDERING FOOTPRINT*
8 PL
PACKAGE DIMENSIONS
0.25 (0.010)
http://onsemi.com
1
8
CASE 751B−05
M
SOIC−16
ISSUE K
6.40
8X
16X
12
M
R
DIMENSIONS: MILLIMETERS
1.12
B
X 45
16
9
S
_
J
PITCH
1.27
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
G
K
M
P
R
F
J
MILLIMETERS
MIN
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
0
1.27 BSC
_
10.00
MAX
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
0.050 BSC
0
INCHES
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_