MAX4951CCTP+T Maxim Integrated, MAX4951CCTP+T Datasheet - Page 2

• Manufacturer Part Number: MAX4951CCTP+T
• Description: Buffers & Line Drivers 6Gbps SATA Bidirecti onal Redriver with I
• Manufacturer: Maxim Integrated

Specifications of MAX4951CCTP+T

• Rohs: yes
• Number Of Input Lines: /
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 3 V

ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
V
AINP, AINM, BINP, BINM, EN, CAD,
Short-Circuit Output Current
Continuous Current at Inputs
Note 1: All I/O pins are clamped by internal diodes.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
values are at V
6Gbps SATA Bidirectional Redriver with Input Equalization,
Operating Power-Supply Range
Operating Supply Current
Standby Supply Current
Dynamic Power-Down Current
Differential Input Resistance
Differential Output Resistance
AC PERFORMANCE
Differential Input Return Loss
(Notes 4, 5)
CC
CC
MODE, PA, PB (Note 1) ........................ -0.3V to (V
BOUTP, BOUTM, AOUTP, AOUTM ............................. Q30mA
AINP, AINM, BINP, BINM .............................................. Q5mA
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
...................................................................... -0.3V to +4.0V
= +3.0V to +3.6V, C
Preemphasis, and Advanced Power Management
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
CC
= +3.3V, T
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CL
= 10nF coupling capacitor on each output, R
A
= +25NC.) (Note 3)
RL
SYMBOL
Z
Z
I
RX-DIFF-
TX-DIFF-
DYNPD
I
RX-DIFF
V
STBY
I
DC
DC
CC
CC
JC
) ................ 6NC/W
JA
) .......... 39NCW
PA = PB = V
active state
PA = PB = GND, D10.2 pattern, f = 3GHz,
active state
EN = GND or CAD = V
(Note 4)
(Note 4)
150MHz P f < 300MHz
300MHz P f < 600MHz
600MHz P f < 1200MHz
1.2GHz P f < 2.4GHz
2.4GHz P f ≤ 3.0GHz
CC
+ 0.3V)
CC
CONDITIONS
, D10.2 pattern, f = 3GHz,
Continuous Power Dissipation (T
Operating Temperature Range ............................ 0NC to +70NC
Storage Temperature Range ........................... -55NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN (derate 25.6mW/NC above +70NC)................. 2051mW
CC
L
= 50I, T
A
= 0NC to +70NC, unless otherwise noted. Typical
MIN
3.0
85
85
18
14
10
8
3
A
= +70NC)
MAX4951C
TYP
100
100
70
60
20
16
MAX
100
500
115
115
3.6
85
20
UNITS
mA
mA
FA
dB
I
I
V