74LVC3G14DP-G NXP Semiconductors, 74LVC3G14DP-G Datasheet
74LVC3G14DP-G
Specifications of 74LVC3G14DP-G
Related parts for 74LVC3G14DP-G
74LVC3G14DP-G Summary of contents
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Triple inverting Schmitt trigger with 5 V tolerant input Rev. 11 — 6 July 2012 1. General description The 74LVC3G14 provides three inverting buffers with Schmitt trigger input capable of transforming slowly changing input signals into sharply ...
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... Marking Table 2. Marking codes Type number 74LVC3G14DP 74LVC3G14DC 74LVC3G14GT 74LVC3G14GF 74LVC3G14GD 74LVC3G14GM 74LVC3G14GN 74LVC3G14GS [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. ...
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... NXP Semiconductors 6. Functional diagram 001aah728 Fig 1. Logic symbol 7. Pinning information 7.1 Pinning 74LVC3G14 GND 001aag081 Fig 4. Pin configuration SOT505-2 and SOT765-1 74LVC3G14 Product data sheet Triple inverting Schmitt trigger with 5 V tolerant input 001aah729 Fig 2. IEC logic symbol ...
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... NXP Semiconductors 74LVC3G14 GND Transparent top view Fig 6. Pin configuration SOT996-2 7.2 Pin description Table 3. Pin description Symbol Pin SOT505-2, SOT765-1, SOT833-1, SOT1089, SOT996-2, SOT1116 and SOT1203 1A, 2A 1Y, 2Y GND Functional description [1] Table 4. ...
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... NXP Semiconductors 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
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... NXP Semiconductors 11. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter = 40 C to +85 C T amb V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I power-off leakage current OFF I supply current CC ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I power-off leakage current OFF I supply current CC I additional supply current CC [1] All typical values are measured at maximum V Table 8. Transfer characteristics Voltages are referenced to GND (ground = 0 V; for test circuit see ...
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... NXP Semiconductors 12. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter Conditions t propagation delay nA to nY; see power dissipation capacitance [1] Typical values are measured the same as t and t ...
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... NXP Semiconductors Table 10. Measurement points 1. 2.7 V 2 3 5.5 V Test data is given in Table R = Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. ...
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... NXP Semiconductors Fig 12. Typical transfer characteristics 15. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula add P = additional power dissipation (W); add f = input frequency (MHz input rise time (ns ...
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... NXP Semiconductors Linear change of V between 0 2.0 V. All values given are typical unless otherwise specified. I (1) Positive-going edge. (2) Negative-going edge. Fig 13. function of V CC(AV --------------------- f = T 0.8 RC Fig 14. Relaxation oscillator 74LVC3G14 Product data sheet Triple inverting Schmitt trigger with 5 V tolerant input 50 Δ ...
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... NXP Semiconductors 16. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1. 0.5 mm terminal 1 index area (2) (4× terminal 1 index area Dimensions (1) Unit max 0.5 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 19. Package outline SOT996-2 (XSON8U) 74LVC3G14 Product data sheet ...
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... NXP Semiconductors XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1 terminal 1 index area terminal 1 index area L 1 Dimensions (1) Unit max 0.5 0.05 0.25 1.65 mm nom 0.20 1.60 min 0.00 0.15 1.55 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.25 mm nom 0.15 1.20 min 0.12 1.15 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1116 Fig 21. Package outline SOT1116 (XSON8) ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1203 Fig 22. Package outline SOT1203 (XSON8) ...
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... NXP Semiconductors 17. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic UTLP Ultra-Thin Leadless Package 18. Revision history Table 13. Revision history Document ID Release date 74LVC3G14 v.11 20120706 • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Triple inverting Schmitt trigger with 5 V tolerant input NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 4 9 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13 Waveforms ...