74HC04PW-T NXP Semiconductors, 74HC04PW-T Datasheet
74HC04PW-T
Specifications of 74HC04PW-T
Related parts for 74HC04PW-T
74HC04PW-T Summary of contents
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... Name Description DIP14 plastic dual in-line package; 14 leads (300 mil) SO14 plastic small outline package ...
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... NXP Semiconductors 4. Functional diagram mna342 Fig 1. Logic symbol 5. Pinning information GND 7 Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 74HC_HCT04 Product data sheet ...
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... NXP Semiconductors 5.1 Pin description Table 2. Pin description Symbol Pin GND Functional description Table 3. Function table H = HIGH voltage level LOW voltage level Input Limiting values Table 4. ...
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... NXP Semiconductors [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. derates linearly with 12 mW/K above 70 C. [2] For DIP14 package: P tot derates linearly with 8 mW/K above 70 C. For SO14 package: P tot derates linearly with 5.5 mW/K above 60 C. ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V LOW-level output voltage = 20 4.0 mA 5.2 mA input leakage current ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = pF; for load circuit see L Symbol Parameter Conditions 74HC04 t propagation delay nA to nY; see transition time see power dissipation per package capacitance 74HCT04 t propagation delay nA to nY; see ...
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... NXP Semiconductors 11. Waveforms Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 6. The input (nA) to output (nY) propagation delay times Table 8. Measurement points Type 74HC04 74HCT04 Test data is given in Table Definitions test circuit: ...
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... NXP Semiconductors Table 9. Test data Type Input V I 74HC04 V CC 74HCT04 3.0 V 74HC_HCT04 Product data sheet Load All information provided in this document is subject to legal disclaimers. Rev. 4 — 3 August 2012 74HC04; 74HCT04 Test PLH PHL ...
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... NXP Semiconductors 12. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 10 ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Revision history Document ID Release date 74HC_HCT04 v.4 20120803 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74HC_HCT04 v.3 20030723 74HC_HCT04_CNV v.2 19970826 74HC_HCT04 ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Abbreviations ...