74HC237D-T NXP Semiconductors, 74HC237D-T Datasheet
74HC237D-T
Specifications of 74HC237D-T
Related parts for 74HC237D-T
74HC237D-T Summary of contents
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... Ordering information Type number Package Temperature range 40 C to +125 C 74HC237N 40 C to +125 C 74HC237D 40 C to +125 C 74HC237DB Name Description DIP16 plastic dual in-line package; 16 leads (300 mil) SO16 plastic small outline package; 16 leads; body width 3.9 mm SSOP16 plastic shrink small outline package ...
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... NXP Semiconductors 4. Functional diagram Fig 1. Functional diagram INPUT A1 LATCHES Fig 2. Logic symbol 74HC237 Product data sheet 3-to-8 line decoder, demultiplexer with address latches INPUT LATCHES DECODER ...
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... NXP Semiconductors Fig 4. Logic diagram 5. Pinning information 5.1 Pinning 74HC237 GND 001aab868 Fig 5. Pin configuration DIP16 and SO16 74HC237 Product data sheet 3-to-8 line decoder, demultiplexer with address latches A0 LATCH LATCH ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin 15, 14, 13, 12, 11, 10 output GND Functional description Table 3: Function table Enable Input ...
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... NXP Semiconductors derates linearly with 12 mW/K above 70 C. [1] For DIP16 package: P tot derates linearly with 8 mW/K above 70 C. [2] For SO16 package: P tot derates linearly with 5.5 mW/K above 60 C. For SSOP16 package: P tot 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I input leakage current supply current 6 input I capacitance 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions t pulse width LE HIGH; see set-up time An to LE; see hold time An to LE; see ...
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... NXP Semiconductors Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 8. Propagation enable inputs (E1) to output (Yn) and output transition time Measurement points are given in V and V are typical voltage output levels that occur with the output load. ...
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... NXP Semiconductors Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 10. Test circuit for measuring switching times Table 9. Test data Type ...
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... NXP Semiconductors 12. Application information strobe decoder enable input 0 address 237 outputs Fig 11. 6-to-64 line decoder with input address storage 74HC237 Product data sheet 3-to-8 line decoder, demultiplexer with address latches ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT338-1 Fig 14 ...
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... NXP Semiconductors 14. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date 74HC237 v.6 20120823 • Modifications: 74HC237 v.5 20111209 • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Application information Package outline ...