74LVC1G17GV-G NXP Semiconductors, 74LVC1G17GV-G Datasheet - Page 2

• Manufacturer Part Number: 74LVC1G17GV-G
• Description: Buffers & Line Drivers SNGL SCHMTT-TRIG BUF
• Manufacturer: NXP Semiconductors

Specifications of 74LVC1G17GV-G

• Product Category: Buffers & Line Drivers
• Rohs: yes
• Number Of Input Lines: 1
• Number Of Output Lines: 1
• Polarity: Non-Inverting
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-753-5
• High Level Output Current: - 32 mA
• Logic Family: LVC
• Logic Type: CMOS
• Low Level Output Current: 32 mA
• Minimum Operating Temperature: - 40 C
• Number Of Channels Per Chip: 1
• Propagation Delay Time: 3.2 ns at 2.7 V
• Factory Pack Quantity: 3000
• Part # Aliases: 74LVC1G17GV,125

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G17
Product data sheet
Type number
74LVC1G17GW
74LVC1G17GV
74LVC1G17GM
74LVC1G17GF
74LVC1G17GN
Type number
74LVC1G17GW
74LVC1G17GV
74LVC1G17GM
74LVC1G17GF
74LVC1G17GN
74LVC1G17GS
74LVC1G17GX
74LVC1G17GS
74LVC1G17GX
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Logic symbol
Ordering information
Marking codes
2
A
Package
Temperature range
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
mnb150
Y
4
All information provided in this document is subject to legal disclaimers.
Name
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
X2SON5
Rev. 10 — 29 June 2012
Marking
VJ
V17
VJ
VJ
VJ
VJ
VJ
plastic extremely thin small outline package;
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
Description
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
plastic surface-mounted package; 5 leads
no leads; 6 terminals; body 1  1.45  0.5 mm
no leads; 6 terminals; body 1  1  0.5 mm
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
X2SON5: plastic thermal enhanced extremely
thin small outline package; no leads; 5
terminals; body 0.8  0.8  0.35 mm
Fig 2.
[1]
IEC logic symbol
2
Single Schmitt trigger buffer
mnb151
74LVC1G17
4
© NXP B.V. 2012. All rights reserved.
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
SOT1226
2 of 21