24AA00T-I/OT Microchip Technology, 24AA00T-I/OT Datasheet - Page 12

IC EEPROM 128BIT 400KHZ SOT23-5

24AA00T-I/OT

Manufacturer Part Number
24AA00T-I/OT
Description
IC EEPROM 128BIT 400KHZ SOT23-5
Manufacturer
Microchip Technology
Datasheets

Specifications of 24AA00T-I/OT

Memory Size
128 (16 x 8)
Package / Case
SOT-23-5, SC-74A, SOT-25
Operating Temperature
-40°C ~ 85°C
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
100kHz, 400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.7 V ~ 5.5 V
Organization
16 K x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.7 V
Maximum Operating Current
5 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
1.8 V, 5.5 V
Memory Configuration
16 X 8
Clock Frequency
400kHz
Supply Voltage Range
1.7V To 5.5V
Memory Case Style
SOT-23
No. Of Pins
5
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
24AA00T-I/OT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
24AA00T-I/OT
Manufacturer:
MCP
Quantity:
3 000
Part Number:
24AA00T-I/OT
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
24AA00T-I/OT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
24AA00/24LC00/24C00
DS21178G-page 12
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
eB
A2
A1
E1
b1
E1
N
A
E
D
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.325
.280
.400
.150
.015
.070
.022
.430
.195
c

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