MAX9665ETP+ Maxim Integrated, MAX9665ETP+ Datasheet - Page 2

• Manufacturer Part Number: MAX9665ETP+
• Description: LCD Gamma Buffers 6/8/10-Channel 10-Bit Nonvolatile Programmable Gamma and VCOM Reference Voltages
• Manufacturer: Maxim Integrated

6/8/10-Channel, 10-Bit, Nonvolatile Programmable
Gamma and VCOM Reference Voltages
ABSOLUTE MAXIMUM RATINGS
Supply Voltages
Outputs
Inputs
Continuous Current
ELECTRICAL CHARACTERISTICS
(V
otherwise noted. Typical values are at T
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
SUPPLIES
Analog-Supply Voltage Range
Analog-Supply Voltage Range for
Programming MTP
Digital-Supply Voltage Range
Analog Quiescent Current
Digital Quiescent Current
DVDD Undervoltage Lockout
DAC
Resol uti on
Integ r al N onl i near i ty E r r or
D i ffer enti al N onl i near i ty E r r or
REF Input Resistance
GAMMA OUTPUTS (Note 4)
S hor t- C i r cui t C ur r ent
M axi m um C ap aci ti ve Load
Output Impedance
Load Reg ul ati on
Total Outp ut E r r or
S l ew Rate
AVDD
AVDD to GND.....................................................-0.3V to +22V
DVDD to GND.......................................................-0.3V to +4V
OUT0–OUT9, VCOM to GND .............-0.3V to (V
SDA, SCL, CE to GND..........................................-0.3V to +4V
CTL, REF to GND ...............................................-0.3V to +22V
FB to GND ..........................................-0.3V to (V
OUT0–OUT9, VCOM...................................................±400mA
All Other Pins ................................................................±50mA
_______________________________________________________________________________________
= V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
REF
= 15.7V, V
DVDD
= 3.3V, V
V
SYMBOL
AVDD_MTP
A
V
V
I
UVLO
I
DVDD
AVDD
D N L
R
AVDD
DVDD
IN L
= +25°C.) (Note 2)
I
Z
S R
GND
S C
EG
O
= 0V, VCOM connected to FB, CTL = DVDD/2, no load, T
AVDD
AVDD
Guaranteed by power-supply rejection
ratio specification (Note 3)
MAX9665
MAX9666
MAX9667
No SCL or SDA transitions
T
T
Outp ut to AV D D or GN D , T
Placed directly at output
Output resistance when output is disabled
- 5m A to + 5m A
T
5V sw i ng , m easur e 10% to 90%
A
A
A
= +25°C, 16 ≤ CODE ≤ 1008
= +25°C, 16 ≤ CODE ≤ 1008
= +25°C, m easur ed at cod e = 512
+ 0.3V)
+ 0.3V)
CONDITIONS
Continuous Power Dissipation (T
Junction-to-Case Thermal Resistance (
Junction-to-Ambient Thermal Resistance (
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
20-Pin TQFN (derate 25.6mW/°C above +70°C) ....2051.3mW
20-Pin TQFN...................................................................6°C/W
20-Pin TQFN.................................................................39°C/W
A
= +25°C
MIN
100
-40
2.7
15
10
9
A
= +70°C)
A
TYP
450
384
400
300
2.3
0.5
= -40°C to +85°C, unless
12
14
16
84
22
θ
JC
θ
) (Note 1)
JA
) (Note 1)
MAX
+40
900
3.6
2.6
20
20
22
24
26
1
1
mV/mA
UNITS
V/µs
LSB
LSB
Bits
mA
mA
mV
kΩ
kΩ
µA
pF
V
V
V
V