MAX2022ETX+TD Maxim Integrated, MAX2022ETX+TD Datasheet - Page 2

• Manufacturer Part Number: MAX2022ETX+TD
• Description: Modulator / Demodulator 1.5-2.5GHz Quadratr Modulator
• Manufacturer: Maxim Integrated

Specifications of MAX2022ETX+TD

• Rohs: yes

MAX2022
Absolute Maximum Ratings
VCC_ to GND .......................................................-0.3V to +5.5V
BBIP, BBIN, BBQP, BBQN to GND .......... -2.5V to (V
LO, RF to GND Maximum Current .....................................50mA
RF Input Power ..............................................................+20dBm
Baseband Differential I/Q Input Power ...........................+20dBm
LO Input Power ..............................................................+10dBm
RBIASLO1 Maximum Current ............................................10mA
RBIASLO2 Maximum Current ............................................10mA
Note 1: Based on junction temperature T
Note 2: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
TQFN
Note 3: Junction temperature T
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
DC Electrical Characteristics
(MAX2022
terminated into 50Ω to GND, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, T
V
Recommended AC Operating Conditions
www.maximintegrated.com
Supply Voltage
Total Supply Current
Total Power Dissipation
RF Frequency
LO Frequency
IF Frequency
LO Power Range
CC
Junction-to-Ambient
Thermal Resistance (θ
= 5V, T
pad is known while the device is soldered down to a PCB. See the
temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
C
PARAMETER
PARAMETER
Typical Application
C
is the temperature on the exposed pad of the package. T
= +25°C, unless otherwise noted.)
JA
) (Notes 3, 4) .....................+34°C/W
Circuit, V
J
= T
A
SYMBOL
SYMBOL
+ (θ
I
TOTAL
V
P
CC
f
f
f
RF
LO
CC
IF
LO
J
= T
= 4.75V to 5.25V, V
JA
C
x V
+ (θ
Pins 3, 13, 15, 31, 33 all connected to V
(Note 5)
(Note 5)
(Note 5)
CC
CC
JC
x I
x V
+ 0.3V)
CC
CC
). This formula can be used when the ambient temperature of the PCB is
x I
GND
CONDITIONS
CONDITIONS
CC
C
). This formula can be used when the temperature of the exposed
Downconversion 1500MHz to 3000MHz
= 0V, I/Q ports terminated into 50Ω to GND, LO and RF ports
RBIASLO3 Maximum Current ............................................10mA
Continuous Power Dissipation (Note 1) ..............................7.6W
Operating Case Temperature Range (Note 2) ... -40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
A
= -40°C to +85°C, unless otherwise noted. Typical values are at
is the ambient temperature of the device and PCB.
Junction-to-Case
Thermal Resistance (θ
Quadrature Modulator/Demodulator
Applications Information
High-Dynamic-Range, Direct Up/
CC
JC
1500
1500
) (Notes 1, 4) ....................+8.5°C/W
4.75
MIN
MIN
-3
section for details. The junction
1460
TYP
5.00
TYP
292
Maxim Integrated │ 2
MAX
1796
MAX
3000
3000
1000
5.25
342
+3
UNITS
UNITS
MHz
MHz
MHz
dBm
mW
mA
V