93LC66B-I/ST Microchip Technology, 93LC66B-I/ST Datasheet - Page 20

IC EEPROM 4KBIT 2MHZ 8TSSOP

93LC66B-I/ST

Manufacturer Part Number
93LC66B-I/ST
Description
IC EEPROM 4KBIT 2MHZ 8TSSOP
Manufacturer
Microchip Technology
Datasheets

Specifications of 93LC66B-I/ST

Memory Size
4K (256 x 16)
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
2MHz
Interface
Microwire, 3-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-TSSOP
Memory Configuration
256 X 16
Ic Interface Type
Microwire
Clock Frequency
3MHz
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
TSSOP
No. Of Pins
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
93LC66B-I/ST
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
DS21795C-page 20
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Contact Width
Contact Length
Drawing No. C04-123
ID INDEX
(NOTE 2)
A3
*Controlling Parameter
Notes:
1.
2.
3.
4. JEDEC equivalent: MO-229
AREA
PIN 1
Package may have one or more exposed tie bars at ends.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Exposed pad dimensions vary with paddle size.
TOP VIEW
Dimension Limits
D
Units
E
D2
E2
A3
A1
D
n
p
A
E
b
L
A1
A
MIN
.055
.047
.008
.012
.031
.000
EXPOSED
METAL
.008 REF.
INCHES
.020 BSC
.079 BSC
.118 BSC
NOM
PAD
8
.010
.016
.035
.001
--
--
EXPOSED
(NOTE 1)
TIE BAR
MAX
.064
.039
.002
.012
.020
.071
b
BOTTOM VIEW
D2
MIN
2
0.80
0.00
1.39
1.20
0.20
0.30
p
1
© 2005 Microchip Technology Inc.
n
MILLIMETERS*
0.20 REF.
0.50 BSC
2.00 BSC
3.00 BSC
NOM
Revised 05/24/04
8
E2
0.90
0.02
0.25
0.40
L
--
--
MAX
1.00
0.05
1.62
1.80
0.30
0.50

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