24LC32AF-I/MS Microchip Technology, 24LC32AF-I/MS Datasheet - Page 19

IC SRL EEPROM 4KX8 2.5V 8-MSOP

24LC32AF-I/MS

Manufacturer Part Number
24LC32AF-I/MS
Description
IC SRL EEPROM 4KX8 2.5V 8-MSOP
Manufacturer
Microchip Technology
Datasheets

Specifications of 24LC32AF-I/MS

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
32K (4K x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Memory Configuration
4K X 8
Interface Type
I2C, Serial, 2-Wire
Clock Frequency
400kHz
Access Time
900ns
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
MSOP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
E
A
NOTE 2
EXPOSED PAD
Units
A1
A3
D2
E2
N
D
A
E
K
e
b
L
L
K
MIN
0.80
0.00
1.30
1.50
0.18
0.30
0.20
24AA32A/24LC32A
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
E2
NOTE 1
DS21713H-page 19

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