NCP380HMU21AATBG ON Semiconductor, NCP380HMU21AATBG Datasheet - Page 18

• Manufacturer Part Number: NCP380HMU21AATBG
• Description: Power Switch ICs - Power Distribution OVER CURRENT PROTECTION
• Manufacturer: ON Semiconductor

Specifications of NCP380HMU21AATBG

• Product Category: Power Switch ICs - Power Distribution
• On Resistance (max): 110 mOhms
• On Time (max): 4 ms
• Off Time (max): 3 ms
• Operating Supply Voltage: 2.5 V to 5.5 V
• Supply Current (max): 90 uA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: UDFN-6
• Current Limit: 2.1 A
• Maximum Power Dissipation: 830 mW
• Minimum Operating Temperature: - 40 C
• Output Current: 2.1 A

application, the limits of the over current threshold can be
calculated with the following formula:
described in the following graph:
range for two reasons.
to high current level. Due to internal power dissipation
capability, a maximum of 2.4 A typical can be set for the
mDFN package if thermal consideration are respected. For
the TSOP6 version 1.2 A is the maximum recommended
value because the part could enter in thermal shutdown
mode before constant current regulation mode.
resistor values can be used up to 50 kW. With higher value,
the current threshold is lower than 500 mA, so in this case
degraded accuracy can be observed.
IOCP min + 1.6915129 * 0.0330328
IOCP max + 2.2885175 * 0.0446914
IOCPtyp + 1.9900152 * 0.0388621
When the resistor is choosing to fit with the Customer
The minimum, typical and maximum current curves are
That is recommended to respect 6 kW−47 kW resistor
For the low resistor values, the current limit is pushed up
In the other side, if we want to keep 15% of accuracy, high
) 0.0000011
) 0.0000009
) 0.0000012
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
5
(Rlim * 22.375)
(Rlim * 22.375)
(Rlim * 22.375)
7
9
11 13
Figure 26. Current Threshold vs. Rlim Resistor
Rlim ) 0.0013185(Rlim * 22.375)
15
Rlim ) 0.0011207(Rlim * 22.375)
Rlim ) 0.0015163(Rlim * 22.375)
4
4
17
4
19 21
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23
R
25
LIM
18
27
(kW)
PCB Recommendations
the PCB design rules must be respected to properly evacuate
the heat out of the silicon. The UDFN6 PAD1 must be
connected to ground plane to increase the heat transfer if
necessary. This pad must be connected to ground plane. By
increasing PCB area, the R
decreased, allowing higher power dissipation.
29
The NCP380 integrates a PMOS FET rated up to 2 A, and
31
33
35 37
IOCP min vs. R
IOCP vs. R
IOCP max vs. R
2
2
* 0.0000531
2
* 0.0000451
* 0.000061
39
41
LIM
43 45
LIM
LIM
(Rlim * 22.375)
47
qJA
(Rlim * 22.375)
(Rlim * 22.375)
of the package can be
3
3
3
)
)
)
(eq. 6)
(eq. 7)
(eq. 8)