25LC256-I/ST Microchip Technology, 25LC256-I/ST Datasheet - Page 19

IC EEPROM 256KBIT 10MHZ 8TSSOP

25LC256-I/ST

Manufacturer Part Number
25LC256-I/ST
Description
IC EEPROM 256KBIT 10MHZ 8TSSOP
Manufacturer
Microchip Technology
Datasheets

Specifications of 25LC256-I/ST

Memory Size
256K (32K x 8)
Package / Case
8-TSSOP
Operating Temperature
-40°C ~ 85°C
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
10MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Organization
32 K x 8
Interface Type
SPI
Maximum Clock Frequency
10 MHz
Access Time
50 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
6 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
25LC256-I/ST
Manufacturer:
MCP
Quantity:
2 963
Part Number:
25LC256-I/ST
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
25LC256-I/ST
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
NOTE 1
A
A1
b
N
1
2
D
e
Dimension Limits
A2
E1
c
E
Units
A2
A1
E1
L1
N
E
D
e
A
L
b
φ
c
L1
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
25AA256/25LC256
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
3.00
0.60
8
Microchip Technology Drawing C04-086B
L
MAX
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
φ
DS21822F-page 19

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