25AA256-I/ST Microchip Technology, 25AA256-I/ST Datasheet - Page 17

IC EEPROM 256KBIT 10MHZ 8TSSOP

25AA256-I/ST

Manufacturer Part Number
25AA256-I/ST
Description
IC EEPROM 256KBIT 10MHZ 8TSSOP
Manufacturer
Microchip Technology
Datasheets

Specifications of 25AA256-I/ST

Memory Size
256K (32K x 8)
Package / Case
8-TSSOP
Operating Temperature
-40°C ~ 85°C
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
10MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Organization
32 K x 8
Interface Type
SPI
Maximum Clock Frequency
10 MHz
Access Time
50 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Maximum Operating Current
6 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
1.8 V, 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
25AA256-I/ST
Manufacturer:
MCP
Quantity:
700
Part Number:
25AA256-I/ST
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
25AA256-I/ST
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
φ
A2
A1
E1
L1
D
N
A
E
α
e
h
L
φ
c
b
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
25AA256/25LC256
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
Microchip Technology Drawing C04-057B
α
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
c
DS21822F-page 17

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