SI3863BDV-T1-E3 Vishay/Siliconix, SI3863BDV-T1-E3 Datasheet

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SI3863BDV-T1-E3

Manufacturer Part Number
SI3863BDV-T1-E3
Description
Power Switch ICs - Power Distribution 12V 2.5A 0.83W
Manufacturer
Vishay/Siliconix
Datasheet

Specifications of SI3863BDV-T1-E3

Product Category
Power Switch ICs - Power Distribution
Rohs
yes
Number Of Outputs
1
On Resistance (max)
0.11 Ohms
Operating Supply Voltage
2.5 V to 12 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
TSOP-6
Maximum Power Dissipation
830 mW
Minimum Operating Temperature
- 55 C
Output Current
2.5 A
Factory Pack Quantity
3000
Part # Aliases
SI3863BDV-E3

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI3863BDV-T1-E3
Manufacturer:
VISHAY
Quantity:
3 031
Document Number: 73343
S09-2110-Rev. B, 12-Oct-09
Note:
* Minimum R1 value should be at least 10 x R2 to ensure Q1 turn-on.
DESCRIPTION
The Si3861BDV includes a P- and N-Channel MOSFET in a
single TSOP-6 package. The low on-resistance P-Channel
TrenchFET
N-Channel, with an external resistor, can be used as a level-
APPLICATION CIRCUITS
ON/OFF
PRODUCT SUMMARY
COMPONENTS
R1
R2
C1
V
4.5 to 20
DS2
V
R2
IN
Optional Slew-Rate Control
Optional Slew-Rate Control
(V)
C
R1
i
®
Pull-Up Resistor
is tailored for use as a load switch. The
4
6
5
0.120 at V
0.145 at V
0.075 at V
Si3861BDV
Q2
Q1
R
DS(on)
1
R2
IN
IN
IN
(Ω)
= 5.0 V
= 4.5 V
= 10 V
Load Switch with Level-Shift
2, 3
6
Typical 10 kΩ to 1 mΩ*
Typical 0 to 100 kΩ*
C
Typical 1000 pF
C1
o
I
± 1.9
± 1.7
D
± 2.3
(A)
V
GND
LOAD
OUT
FEATURES
The Si3861BDV is ideally suited for high-side load switching
in portable applications. The integrated N-Channel level-shift
device saves space by reducing external components. The
slew rate is set externally so that rise-times can be tailored to
different load types.
shift to drive the P-Channel load-switch. The N-Channel
MOSFET has internal ESD protection and can be driven by
logic signals as low as 1.5 V. The Si3861DV operates on
supply lines from 4.5 to 20 V, and can drive loads up to 2.3 A.
• Halogen-free According to IEC 61249-2-21
• 4.5 V Rated
• ESD Protected: 3000 V
• 105 mΩ Low R
• 4.5 V to 20 V Input
• 1.5 V to 8 V Logic Level Control
• Low Profile, Small Footprint TSOP-6 Package
• 3000 V ESD Protection On Input Switch, V
• Adjustable Slew-Rate
• Compliant to RoHS Directive 2002/95/EC
Definition
10
8
6
4
2
0
0
Note: For R2 switching variations with other V
DS(on)
2
combinations See Typical Characteristics
t
t
d(off)
d(on)
t
r
TrenchFET
4
R2 (kΩ)
6
Vishay Siliconix
®
t
f
Si3861BDV
8
I
V
C
C
L
ON/OFF
i
o
= 1 A
= 10 µF
= 1 µF
www.vishay.com
ON/OFF
10
= 3 V
IN
/R1
12
1

Related parts for SI3863BDV-T1-E3

SI3863BDV-T1-E3 Summary of contents

Page 1

Load Switch with Level-Shift PRODUCT SUMMARY V (V) R (Ω) DS2 DS(on) 0.075 0.120 5 0.145 4 DESCRIPTION The Si3861BDV includes ...

Page 2

Si3861BDV Vishay Siliconix FUNCTIONAL BLOCK DIAGRAM TSOP-6 Top View Ordering Information: Si3861BDV-T1-E3 (Lead (Pb)-free) Si3861BDV-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS T Parameter Input Voltage ON/OFF Voltage Load Current a Continuous Intrinsic Diode ...

Page 3

TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 0. 1 0.45 ON/OFF 0.40 0.35 0. 125 C J 0.25 0.20 T 0.15 0.10 0.05 0. (A) L ...

Page 4

Si3861BDV Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 1.8 1 1.4 1.2 1.0 0 ON/OFF 0.2 0.0 - 100 - ...

Page 5

TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0. Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified ...

Page 6

TSOP: 5/6−LEAD JEDEC Part Number: MO-193C 5-LEAD TSOP D 0.08 C Dim ECN: C-06593-Rev. I, 18-Dec-06 DWG: 5540 Document Number: 71200 18-Dec- 0.15 M ...

Page 7

Mounting LITTLE FOOT Surface mounted power MOSFET packaging has been based on integrated circuit and small signal packages. Those packages have been modified to provide the improvements in heat transfer required by power MOSFETs. Leadframe materials and design, molding compounds, ...

Page 8

AN823 Vishay Siliconix 140 − 170_C 3_C/s (max) FIGURE 3. Solder Reflow Temperature and Time Durations THERMAL PERFORMANCE A basic measure of a device’s thermal performance is the junction-to-case thermal resistance, junction-to-foot thermal resistance, Rq measured for the device mounted ...

Page 9

Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR TSOP-6 Return to Index Return to Index www.vishay.com 26 0.099 (2.510) 0.039 0.020 0.019 (1.001) (0.508) (0.493) Recommended Minimum Pads Dimensions in Inches/(mm) Document Number: 72610 Revision: 21-Jan-08 ...

Page 10

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), ...

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