MAX3228EBV-T Maxim Integrated, MAX3228EBV-T Datasheet - Page 11

• Manufacturer Part Number: MAX3228EBV-T
• Description: RS-232 Interface IC 2.5-5.5V Transceiver
• Manufacturer: Maxim Integrated
• Series: MAX3228, MAX3229r

Specifications of MAX3228EBV-T

• Data Rate: 250 Kbps
• Operating Supply Voltage: 2.5 V to 5.5 V
• Supply Current: 10 uA
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: UCSP-20 6 x 5
• Number Of Drivers: 2
• Number Of Receivers: 2

Table 5. Reliability Test Data
Temperature Cycle
Operating Life
Moisture Resistance
Low-Temperature Storage
Low-Temperature Operational
Solderability
ESD
High-Temperature Operating
Life
TTL/CMOS
C
BYPASS
0.1µF
0.1µF
C1
C2
TEST
0.1µF
Typical Operating Circuits
C6
C1
D1
A2
A3
A6
B5
C1+
C1-
C2+
C2-
T1IN
R1OUT
FORCEON
______________________________________________________________________________________
2.5V TO 5.5V
20µA
V
CC
A1
MAX3229
V
L
GND
V
V
L
L
1.65V TO 5.5V
E1
V
+2.5V to +5.5V RS-232 Transceivers
L
-35 C to +85 C,
-40 C to +100 C
T
+20 C to +60 C, 90% RH
-20 C
-10 C
8hr steam age
T
V
L
A5
A
2000V, Human Body Model
J
FORCEOFF
20µA
= +150°C
INVALID
= +70 C
T1OUT
5kΩ
R1IN
V+
V-
CONDITIONS
(continued)
E5
E2
C5
B1
A4
E3
TO POWER-
MANAGEMENT
UNIT
V
L
C3
0.1µF
C4
0.1µF
0.1µF
RS-232
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. CSP relia-
bility is integrally linked to the user’s assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering use
of a CSP package. Performance through Operating Life
Test and Moisture Resistance remains uncompromised
as it is primarily determined by the wafer-fabrication
process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Table 5 shows the testing done to characterize
the CSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through envi-
ronmental stresses as indicated by the results in the
table. Additional usage data and recommendations are
detailed in the UCSP application note, which can be
found on Maxim’s website at www.maxim-ic.com.
TRANSISTOR COUNT: 698
PROCESS TECHNOLOGY: CMOS
DURATION
150 cycles,
900 cycles
240hr
240hr
240hr
168hr
24hr
—
—
Chip Information
UCSP Reliability
NO. OF FAILURES PER
SAMPLE SIZE
in UCSP
0/200
0/10,
0/10
0/10
0/10
0/10
0/15
0/45
0/5
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