MAX14601ETA+T Maxim Integrated, MAX14601ETA+T Datasheet - Page 2
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MAX14601ETA+T
Manufacturer Part Number
MAX14601ETA+T
Description
Power Switch ICs - USB 3rd Generation USB Host Charger ID SW with CDP Emulation
Manufacturer
Maxim Integrated
Datasheet
1.MAX14602ETAT.pdf
(16 pages)
ABSOLUTE MAXIMUM RATINGS
All voltages referenced to GND.
V
Continuous Current into Any Terminal ............................ Q30mA
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
POWER SUPPLY
Power-Supply Range
Supply Current
ANALOG SWITCH
Analog-Signal Range
On-Resistance TDP/TDM Switch
On-Resistance Match Between
Channels TDP/TDM Switch
On-Resistance Flatness
TDP/TDM Switch
On-Resistance of DP/DM Short
Off-Leakage Current
On-Leakage Current
DYNAMIC PERFORMANCE (Note 4)
Turn-On Time
USB Host Charger Identification/Adapter Emulators
CC
CC
TDFN (derate 11.9mW/NC above +70NC) .................953.5mW
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
, TDP, TDM, CB0, CB1, DP, DM, CEN, CEN .... -0.3V to +6.0V
= 3.0V to 5.5V, T
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
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A
= T
MIN
to T
A
= +70NC)
MAX
V
SYMBOL
I
I
R
TDPOFF,
TDMOFF
DP
I
I
R
DR
DPON
DMON
SHORT
, unless otherwise noted. Typical values are at V
R
V
t
I
FLAT
CC
ON
CC
, V
ON
ON
JC
DM
) ...............37NC/W
,
JA
) ..........84NC/W
V
V
V
V
V
V
V
10mA
V
I
V
I
V
= 20kW
V
V
V
V
V
C
DP
DP
CB0
CB0
TDP
TDP
CB_
CB0
CB0
CB0
CB0
CC
CC
CB0
CC
CC
TDP
L
= 35pF, V
= I
= I
= 5.0V, V
= 5.0V, V
= 3.6V, V
= 3.6V, V
= V
= V
= V
= V
= 0V, V
or V
> V
= 0V (Note 3)
= V
= V
= 0V, V
DM
DM
TDM
TDM
CC
CC
IH
CB1
CB1
= 10mA
= 10mA
TDM
= 5.25V, V
CB1
= 0V to V
= 3.3V to 0.3V
IH
CB1
DP
DP
DP
DP
= V
= 0V, AM mode
CONDITIONS
= 1.5V, R
= V
= V
= V
= V
= V
= V
CC
= V
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
CC,
DM
DM
DM
DM
CC
= 5.25V, CM mode
CC
CC
CB1
V
= 400mV,
= 0 to V
= 0.3V to 3.3V,
= 3.3V to 0.3V,
= 5.25V, FM mode
IL
MAX14600–MAX14605
, V
L
, I
= 300I,
= 0V, Figure 1
TDP
DP
= 0V, PM mode
= 1V, R
= I
CC
TDM
,
=
DM
CC
= 5.0V, T
4.75
-250
-250
MIN
3.0
0
A
= +25NC.) (Note 2)
TYP
130
300
3.5
0.1
0.1
50
10
70
4
+250
+250
MAX
5.25
V
100
200
120
800
5.5
6.5
20
50
CC
UNITS
FA
nA
nA
Fs
I
I
I
I
V
V