IS62WV1288BLL-55TLI ISSI, Integrated Silicon Solution Inc, IS62WV1288BLL-55TLI Datasheet - Page 15

• Manufacturer Part Number: IS62WV1288BLL-55TLI
• Description: IC SRAM 1MBIT 55NS 32TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: Asynchronousr

Specifications of IS62WV1288BLL-55TLI

• Memory Size: 1M (128K x 8)
• Package / Case: 32-TSOP
• Interface: Parallel
• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Speed: 55ns
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Access Time: 55 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 8 mA
• Organization: 128 K x 8
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Ports: 1
• Operating Supply Voltage: 2.5 V to 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 706-1111; IS62WV1288BLL-55TLI

PACKAGING INFORMATION
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. C
06/13/03
Plastic TSOP-Type I
Package Code: T (32-pin)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
S
No. Leads
Symbol
A1
A
B
C
D
E
H
S
e
L
α
18.30
19.80
MILLIMETERS
Min.
0.05
0.17
0.12
7.90
0.40
—
0°
0.50 BSC
0.25 REF
e
D
18.50
20.20
Max.
1.20
0.25
0.23
0.17
8.10
0.60
8°
32
0.002
0.007
0.005
0.311
0.720
0.780
0.016
Min.
B
—
0°
0.020 BSC
0.010 REF
N
1
INCHES
A
E
0.047
0.010
0.009
0.007
0.319
0.728
0.795
0.024
Max.
A1
8°
1-800-379-4774
H
SEATING PLANE
Notes:
1. Controlling dimension: millimeters, unless
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
4. Formed leads shall be planar with respect
L
otherwise specified.
flash protrusions and should be measured
from the bottom of the package.
to one another within 0.004 inches at the
seating plane.
α
C