MAX1906VEEE Maxim Integrated, MAX1906VEEE Datasheet - Page 12

• Manufacturer Part Number: MAX1906VEEE
• Description: Battery Management
• Manufacturer: Maxim Integrated
• Series: MAX1906r

The MAX1906 has an unused pin placed between
each of the cell connections. These extra pins minimize
the risk of a solder short between pins during the assem-
bly process. Resistors in series with each B_P pin
are recommended to limit the current in case there is a
short between adjacent B_P pins (see the Typical
Application Circuits).
The MAX1906 is powered from the top cell during the
sampling period. The 300µA typical sampling current,
multiplied by a 10Ω series resistor can move the over-
voltage trip point on the top cell by 3mV. The intermedi-
ate cell quiescent current is typically 500pA. A 1kΩ
resistor in series with any cell except the top one alters
the overvoltage trip point by typically 0.5mV. It is rec-
ommended to use a resistor of 10Ω in series with the
top cell and 1kΩ resistors in series with the rest of the
cells to achieve the desired overvoltage threshold toler-
ance while limiting the potential short-circuit current.
Li+ Battery-Pack Protector with
Integrated Fuse Driver
Table 1. MOSFET Suppliers
Table 2. Recommended Fuse Manufacturers
12
Sony Chemicals Corp.
Uchihashi Estec Co., Ltd
Fairchild
International Rectifier
Vishay Siliconix
______________________________________________________________________________________
MANUFACTURER
SUPPLIER
RC Filters On Cell Inputs
[phone]
[phone]
408-721-2181
310-322-3331
408-988-8000
USA PHONE
PHONE
The MAX1906 has internal ESD diodes on each B_P pin
for ESD protection up to 2kV. When higher ESD ratings
are needed, capacitors (typically 0.1µF) can be added
across adjacent B_P pins (see the Typical Application
Circuits). The RC filters improve the device immunity to
ESD.
Good layout is important to minimize the effects of
noise on the system and ensure accurate voltage mea-
surements. Use appropriate trace widths for the high-
current paths and keep traces short to minimize para-
sitic inductance and capacitance. Provide adequate
space and board area for the sense resistor to dissi-
pate heat. Place RC filters close to B1P–B4P pins. If
some amount of heat sinking is needed to use the inter-
nal SCR, connect the exposed backside paddle to as
large a copper area as practical.
TRANSISTOR COUNT: 4027
PROCESS: BiCMOS
[phone]
[phone]
FACTORY FAX
408-721-1635
310-322-3332
408-567-8979
FAX
Layout Guidelines
Chip Information
www.fairchildsemi.com
www.irf.com
www.vishay.com
www.sccj.co.jp/html_e/
www.uchihashi.co.jp/
WEBSITE
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