MT46H16M32LFCM-6:B TR Micron Technology Inc, MT46H16M32LFCM-6:B TR Datasheet - Page 2

• Manufacturer Part Number: MT46H16M32LFCM-6:B TR
• Description: IC DDR SDRAM 512MBIT 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H16M32LFCM-6:B TR

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 115mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1381-2

Table 2: Configuration Addressing 512
Figure 1: 512Mb Mobile LPDDR Part Numbering
Micron Technology
Product Family
46 = Mobile LPDDR
Operating Voltage
H = 1.8V/1.8V
HC = 1.8V/1.2V
Configuration
32 Meg x 16
16 Meg x 32
Addressing
LF = Mobile standard addressing
LG = Reduced page-size option
Package Codes
BF = 8mm x 9mm, VFBGA, green
CM = 10mm x 13mm, VFBGA, green
CX = 9mm x 13mm, VFBGA, green
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Architecture
Configuration
Refresh count
Row addressing
Column addressing
8 Meg x 16 x 4 banks
32 Meg x 16
MT
A[12:0]
A[9:0]
8K
46
H 32M16 LF
4 Meg x 32 x 4 banks
16 Meg x 32
BF
A[12:0]
A[8:0]
8K
-6
2
512Mb: x16, x32 Mobile LPDDR SDRAM
L
IT
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Reduced Page-Size Option 16 Meg x 32
:B
Design Revision
:B = Second generation
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Power
Blank = Standard I
L = Low-power I
Cycle Time
-5 = 5ns
-54 = 5.4ns
-6 = 6ns
-75 = 7.5ns
4 Meg x 32 x 4 banks
t
t
CK, CL = 3
CK, CL = 3
t
t
CK, CL = 3
CK, CL = 3
A[13:0]
A[7:0]
© 2004 Micron Technology, Inc. All rights reserved.
8K
DD2
DD2
/I
DD6
/I
DD6
Features