MT46H16M32LFCM-6:B TR Micron Technology Inc, MT46H16M32LFCM-6:B TR Datasheet - Page 4

• Manufacturer Part Number: MT46H16M32LFCM-6:B TR
• Description: IC DDR SDRAM 512MBIT 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H16M32LFCM-6:B TR

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 115mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1381-2

Figure 3:
Die Bond Pad Order Changes
PDF: 09005aef82dfb176 / Source: 09005aef82dfb194
tn4616_512_mddr_95_to_78nm_t37_47m.fm - Rev. B 9/07 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls are
Ø0.42 on Ø0.4 SMD
ball pads.
Seating
plane
60x Ø0.45
7.2
0.1 A
0.8 TYP
New 78nm, x16, 8 x 9mm, 60-ball VFBGA
0.8 TYP
3.6
Notes:
A
9
1. Dimensions are in millimeters.
The 78nm, JEDEC-standard bond pad order is noticeably different from the 95nm bond
pad order. An example of the differences for the x16 double-sided configuration is
shown in Table 2 on page 5.
The JEDEC pad ordering guidelines do not specify exact placement requirements.
Therefore, they do not guarantee bonding compatibility among vendors. Compatibility
can be verified by direct comparison of die data sheet bond pad information.
8
7
8 ±0.1
6.4
3.2
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
4.5 ±0.05
0.65 ±0.05
TN-46-16: 512Mb Mobile DDR: 95nm to 78nm
4
Ball A1 ID
0.3 ±0.025
9 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
Die Bond Pad Order Changes
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
©2007 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID