W25Q80BVDAIG Winbond Electronics, W25Q80BVDAIG Datasheet - Page 68

• Manufacturer Part Number: W25Q80BVDAIG
• Description: SPI FLASH 8MBIT 8-DIP
• Manufacturer: Winbond Electronics

Specifications of W25Q80BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 8M (1M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SEATING PLANE
SEATING PLANE
Y
Y
SYMBOL
8
8
1
1
D
E
Y
A1
e
H
A
θ
b
L
c
(2)
(4)
(3)
(3)
E
b
b b b
D
D
Min
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
---
0°
MILLIMETERS
e
e
1.27 BSC
5
5
4
4
A1
A1
Max
E H
E H
E H
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
A
A
10°
- 68 -
E
E
E
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
---
0°
INCHES
0.050 BSC
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
0.25
0.25
10°
W25Q80BV
GAUGE PLANE
GAUGE PLANE
c
c
L
L
θ
θ