M48Z35Y-70PC1 STMicroelectronics, M48Z35Y-70PC1 Datasheet - Page 6
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M48Z35Y-70PC1
Manufacturer Part Number
M48Z35Y-70PC1
Description
IC NVSRAM 256KBIT 70NS 28DIP
Manufacturer
STMicroelectronics
Specifications of M48Z35Y-70PC1
Format - Memory
RAM
Memory Type
NVSRAM (Non-Volatile SRAM)
Memory Size
256K (32K x 8)
Speed
70ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Package / Case
28-DIP Module (600 mil), 28-EDIP
Data Bus Width
8 bit
Organization
32 Kb x 8
Interface Type
Parallel
Access Time
70 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Operating Current
50 mA
Maximum Operating Temperature
70 C
Minimum Operating Temperature
0 C
Mounting Style
Through Hole
Capacitance, Input
10 pF
Capacitance, Output
10 pF
Current, Input, Leakage
±1 μA
Current, Operating
50 mA
Current, Output, Leakage
±5
Data Retention
10 yrs.
Density
256K
Package Type
PCDIP28
Power Dissipation
1 W
Temperature, Operating
0 to +70 °C
Time, Access
70 ns
Time, Fall
≤5 ns
Time, Rise
≤5 ns
Voltage, Input, High
4.8 to 5.8 V
Voltage, Input, Low
0.8 V
Voltage, Output, High
2.4 V
Voltage, Output, Low
0.4 V
Voltage, Supply
4.5 to 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-2885-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M48Z35Y-70PC1
Manufacturer:
ST
Quantity:
20 000
3
Caution:
Caution:
14/23
Maximum rating
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 7.
1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to
2. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal
Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up
mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
T
Symbol
exceed 150°C for longer than 30 seconds).
budget not to exceed 245°C for greater than 30 seconds).
SLD
T
V
V
P
T
STG
I
CC
O
IO
A
D
(1)(2)
Absolute maximum ratings
Ambient operating temperature
Storage temperature (V
off)
Lead solder temperature for 10 seconds
Input or output voltages
Supply voltage
Output current
Power dissipation
Parameter
CC
off, oscillator
SNAPHAT
CAPHAT
SOIC
®
®
DIP
top
–55 to 125
–0.3 to 7.0
–0.3 to 7.0
–40 to 85
–40 to 85
0 to 70
Value
260
20
1
Unit
mA
°C
°C
°C
°C
°C
W
V
V