M48Z35Y-70PC1 STMicroelectronics, M48Z35Y-70PC1 Datasheet - Page 6

• Manufacturer Part Number: M48Z35Y-70PC1
• Description: IC NVSRAM 256KBIT 70NS 28DIP
• Manufacturer: STMicroelectronics

Specifications of M48Z35Y-70PC1

• Format - Memory: RAM
• Memory Type: NVSRAM (Non-Volatile SRAM)
• Memory Size: 256K (32K x 8)
• Speed: 70ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-DIP Module (600 mil), 28-EDIP
• Data Bus Width: 8 bit
• Organization: 32 Kb x 8
• Interface Type: Parallel
• Access Time: 70 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Operating Current: 50 mA
• Maximum Operating Temperature: 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: Through Hole
• Capacitance, Input: 10 pF
• Capacitance, Output: 10 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 50 mA
• Current, Output, Leakage: ±5
• Data Retention: 10 yrs.
• Density: 256K
• Package Type: PCDIP28
• Power Dissipation: 1 W
• Temperature, Operating: 0 to +70 °C
• Time, Access: 70 ns
• Time, Fall: ≤5 ns
• Time, Rise: ≤5 ns
• Voltage, Input, High: 4.8 to 5.8 V
• Voltage, Input, Low: 0.8 V
• Voltage, Output, High: 2.4 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 4.5 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-2885-5

3
Caution:
Caution:
14/23
Maximum rating
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 7.
1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to
2. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal
Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up
mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
T
Symbol
exceed 150°C for longer than 30 seconds).
budget not to exceed 245°C for greater than 30 seconds).
SLD
T
V
V
P
T
STG
I
CC
O
IO
A
D
(1)(2)
Absolute maximum ratings
Ambient operating temperature
Storage temperature (V
off)
Lead solder temperature for 10 seconds
Input or output voltages
Supply voltage
Output current
Power dissipation
Parameter
CC
off, oscillator
SNAPHAT
CAPHAT
SOIC
®
®
DIP
top
–55 to 125
–0.3 to 7.0
–0.3 to 7.0
–40 to 85
–40 to 85
0 to 70
Value
260
20
1
Unit
mA
°C
°C
°C
°C
°C
W
V
V