AT24C512BW-SH-B Atmel, AT24C512BW-SH-B Datasheet - Page 12
![IC EEPROM 512KBIT 1MHZ 8SOIC](/photos/6/50/65032/453-8-soic_sml.jpg)
AT24C512BW-SH-B
Manufacturer Part Number
AT24C512BW-SH-B
Description
IC EEPROM 512KBIT 1MHZ 8SOIC
Manufacturer
Atmel
Datasheet
1.AT24C512BN-SH25-T.pdf
(26 pages)
Specifications of AT24C512BW-SH-B
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
512K (64K x 8)
Speed
1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Organization
64 K x 8
Interface Type
2-Wire
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.8 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C512BW-SH-B
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Ordering Information
Notes:
12
8P3
8S1
8S2
8A2
8Y7
8U2-1
–1.8
–2.5
Ordering Code
AT24C512B-PU (Bulk form only)
AT24C512B-PU25 (Bulk form only)
AT24C512BN-SH-B
AT24C512BN-SH-T
AT24C512BN-SH25-B
AT24C512BN-SH25-T
AT24C512BW-SH-B
AT24C512BW-SH-T
AT24C512BW-SH25-B
AT24C512BW-SH25-T
AT24C512B-TH-B
AT24C512B-TH-T
AT24C512B-TH25-B
AT24C512B-TH25-T
AT24C512BY7-YH-T
AT24C512BY7-YH25-T
AT24C512BU2-UU-T
AT24C512B-W-11
1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel.
3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
AT24C512B
Please contact Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200” Wide Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (1.8V to 3.6V)
Low-voltage (2.5V to 5.5V)
(2)
(1)
(3)
(2)
(1)
(2)
(1)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(2)
(2)
(2)
(NiPdAu Lead Finish)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Options
Voltage
1.8
2.5
1.8
1.8
2.5
2.5
1.8
1.8
2.5
2.5
1.8
1.8
2.5
2.5
1.8
2.5
1.8
1.8
Package
Die Sale
8U2-1
8P3
8P3
8S1
8S1
8S1
8S1
8S2
8S2
8S2
8S2
8A2
8A2
8A2
8A2
8Y7
8Y7
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
5297A–SEEPR–1/08