AT24C01B-TSU-T Atmel, AT24C01B-TSU-T Datasheet - Page 13

• Manufacturer Part Number: AT24C01B-TSU-T
• Description: IC EEPROM 1KBIT 1MHZ SOT23-5
• Manufacturer: Atmel

Specifications of AT24C01B-TSU-T

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (128 x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: SOT-23-5, SC-74A, SOT-25
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AT24C01B Ordering Information
Notes:
5156E–SEEPR–10/08
8P3
8S1
8A2
8Y6
5TS1
8U3-1
Ordering Code
AT24C01B-PU (Bulk form only)
AT24C01BN-SH-B
AT24C01BN-SH-T
AT24C01B-TH-B
AT24C01B-TH-T
AT24C01BY6-YH
AT24C01B-TSU
AT24C01BU3-UU
AT24C01B-W-11
1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT 23 and dBGA2 = 5K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
-T(2)
(2)
(1)
(3)
-T(2)
-T(2)
(2)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Package
8P3
8S1
8S1
8A2
8A2
8Y6
5TS1
8U3-1
Die Sale
Voltage
Range
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
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