93AA56A-I/SN Microchip Technology, 93AA56A-I/SN Datasheet
93AA56A-I/SN
Specifications of 93AA56A-I/SN
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93AA56A-I/SN Summary of contents
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... Function CS Chip Select CLK Serial Data Clock DI Serial Data Input DO Serial Data Output V Ground internal connection ORG Memory Configuration V Power Supply CC © 2007 Microchip Technology Inc. 93AA56A/B/C, 93LC56A/B/C, ORG Pin Word Size Temp Ranges No 8-bit No 16-bit No 8-bit 16-bit 8-bit 16-bit I, E Yes ...
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... Package Types (not to scale) ROTATED SOIC PDIP/SOIC (ex: 93LC46BX ORG CLK CLK TSSOP/MSOP SOT-23 (ST, MS) (OT CLK ORG DFN CLK 2 6 ORG ORG pin A/B devices DS21794E-page 2 (P, SN ORG * CLK © 2007 Microchip Technology Inc. ...
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... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................7.0V CC All inputs and outputs w.r.t. V ..........................................................................................................-0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...
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... TABLE 1-2: AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol Parameter No Clock frequency CLK A2 T Clock high time CKH A3 T Clock low time CKL A4 T Chip Select setup time CSS A5 T Chip Select hold time ...
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... FIGURE 1-1: SYNCHRONOUS DATA TIMING CSS CLK DIS (Read (Program Note relative to CS. SV TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX56B OR 93XX56C WITH ORG = 1) Instruction SB Opcode 11 X ERASE 1 00 ERAL EWDS EWEN READ WRITE 1 00 WRAL 1 0 TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX56A OR 93XX56C WITH ORG = 0) ...
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... FUNCTIONAL DESCRIPTION When the ORG pin (93XX56C) pin is connected the (x16) organization is selected. When connected to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a High-Z state except when read- ing data from the device, or when checking the Ready/ Busy status during a programming operation ...
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... Erase The ERASE instruction forces all data bits of the speci- fied address to the logical ‘1’ state brought low following the loading of the last address bit. This falling edge of the CS pin initiates the self-timed program- ming cycle, except on ‘93C’ devices where the rising edge of CLK before the last address bit initiates the write cycle ...
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... Erase All (ERAL) The Erase All (ERAL) instruction will erase the entire memory array to the logical ‘1’ state. The ERAL cycle is identical to the erase cycle, except for the different opcode. The ERAL cycle is completely self-timed and commences at the falling edge of the CS, except on ‘ ...
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... Erase/Write Disable and Enable (EWDS/EWEN) The 93XX56A/B/C powers up in the Erase/Write Disable (EWDS) state. All programming modes must be preceded by an Erase/Write Enable (EWEN) instruction. FIGURE 2-5: EWDS TIMING CS CLK FIGURE 2-6: EWEN TIMING CS CLK 2.7 Read The READ instruction outputs the serial data of the addressed memory location on the DO pin ...
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... The WRITE instruction is followed by 8 bits (if ORG is low or A-version devices bits (if ORG pin is high or B-version devices) of data which are written into the specified address. For 93AA56A/B/C and 93LC56A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle ...
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... Write All (WRAL) The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. For 93AA56A/B/C and 93LC56A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle ...
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... PIN DESCRIPTIONS TABLE 3-1: PIN DESCRIPTIONS SOIC/PDIP/ Name MSOP/TSSOP/ DFN CS 1 CLK ORG/ 3.1 Chip Select (CS) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle which is already in progress will be completed, regardless of the Chip Select (CS) input signal ...
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... PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead MSOP (150 mil) XXXXXXT YWWNNN 6-Lead SOT-23 XXNN 8-Lead PDIP XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead 2x3 DFN XXX YWW NN © 2007 Microchip Technology Inc. ...
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... Part Number TSSOP MSOP 93AA56A A56A 3A56AT 93AA56B A56B 3A56BT 93AA56C A56C 3A56CT 93LC56A L56A 3L56AT 93LC56B L56B 3L56BT 93LC56C L56C 3L56CT 93C56A C56A 3C56AT 93C56B C56B 3C56BT 93C56C C56C 3C56CT Note Temperature grade ( Alphanumeric traceability code Legend: XX...X ...
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... Plastic Micro Small Outline Package (MS or UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width ...
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... Plastic Small Outline Transistor (CH or OT) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N PIN LASER MARK Number of Pins Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff ...
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... Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane ...
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... Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width ...
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... Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width ...
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... Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE TOP VIEW A3 Number of Pins Pitch Overall Height Standoff Contact Thickness ...
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... APPENDIX A: REVISION HISTORY Revision B Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision C Added DFN package. Revision D (11/2006) Updated Package Drawings and Product ID System Revision E (3/2007) Replaced Package Drawings; Revised Product ID System (SOIC-SN package). © 2007 Microchip Technology Inc. ...
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... NOTES: DS21794E-page 22 © 2007 Microchip Technology Inc. ...
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... THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’ ...
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... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...
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... Device Pinout Tape & Reel Temperature Range Device: 93AA56A: 2K 1.8V Microwire Serial EEPROM 93AA56B: 2K 1.8V Microwire Serial EEPROM 93AA56C: 2K 1.8V Microwire Serial EEPROM w/ORG 93LC56A: 2K 2.5V Microwire Serial EEPROM 93LC56B: 2K 2.5V Microwire Serial EEPROM 93LC56C: 2K 2.5V Microwire Serial EEPROM w/ORG 93C56A ...
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... NOTES: DS21794E-page 26 © 2007 Microchip Technology Inc. ...
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... Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...