AT25160B-SSHL-T Atmel, AT25160B-SSHL-T Datasheet - Page 21
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AT25160B-SSHL-T
Manufacturer Part Number
AT25160B-SSHL-T
Description
IC EEPROM 16KBIT 20MHZ 8SOIC
Manufacturer
Atmel
Datasheet
1.AT25080B-PU.pdf
(26 pages)
Specifications of AT25160B-SSHL-T
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
16K (2K x 8)
Speed
5MHz, 10MHz, 20MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Density
16Kb
Interface Type
Serial (SPI)
Organization
2Kx8
Access Time (max)
80ns
Frequency (max)
5MHz
Write Protection
Yes
Data Retention
100Year
Operating Supply Voltage (typ)
2.5/3.3/5V
Package Type
SOIC
Operating Temp Range
-40C to 85C
Supply Current
10mA
Operating Supply Voltage (min)
1.8V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT25160B-SSHL-T
Manufacturer:
ATMEL
Quantity:
76
Part Number:
AT25160B-SSHL-T
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
5228D–SEEPR–4/10
8A2 – TSSOP
Notes: 1. This drawing is for general information only. Refer to
GND NC NC NC
SDA SCL NC V
packagedrawings@atmel.com
4
5
Package Drawing Contact:
Top View
Pin 1 indicator
2. Dimension
3. Dimension E1 does not include inter-lead Flash or
4. Dimension b does not include Dambar protrusion.
5. Dimension D and E1 to be determined at Datum
this corner
3
6
JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
protrusions or gate burrs. Mold Flash, protrusions and
gate burrs shall not
exceed 0.15 mm (0.006 in) per side.
protrusions. Inter-lead Flash and protrusions shall not
exceed 0.25 mm (0.010 in) per side.
Allowable Dambar protrusion shall be 0.08 mm total
in excess of the b dimension at maximum material
condition. Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion
and adjacent lead is 0.07 mm.
Plane H.
2
7
1
8
CC
D
E1
does
not
E
8A2, 8-lead, 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
TITLE
include
mold
End View
Flash,
L
L1
SYMBOL
D
E
E1
A
A2
b
e
L
L1
COMMON DIMENSIONS
(Unit of Measure = mm)
2.90
4.30
0.80
0.19
0.45
MIN
–
Side View
AT25080B/160B
GPC
6.40 BSC
0.65 BSC
1.00 RE3
TNR
NOM
3.00
4.40
1.00
0.60
D
b
–
–
DRAWING NO.
e
13.10
MAX
4.50
1.20
1.05
0.30
0.75
8A2
A2
NOTE
2, 5
3, 5
4
A
12/11/09
REV.
D
21