BZX84C36ET1 ON Semiconductor, BZX84C36ET1 Datasheet

BZX84C36ET1

Manufacturer Part Number

BZX84C36ET1

Description

Zener Diodes 36V 225mW

Manufacturer

ON Semiconductor

Datasheet

1.SZBZX84C56LT1G.pdf (6 pages)

Specifications of BZX84C36ET1

Product Category

Zener Diodes

Zener Voltage

36 V

Voltage Tolerance

6 %

Voltage Temperature Coefficient

33.9 mV/k

Zener Current

10 mA

Power Dissipation

300 mW

Maximum Reverse Leakage Current

0.05 uA

Maximum Zener Impedance

90 Ohms

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Package / Case

SOT-23

Configuration

Single

Minimum Operating Temperature

- 65 C

Factory Pack Quantity

3000

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BZX84CxxxET1G Series,

SZBZX84CxxxET1G Series

Zener Voltage Regulators

225 mW SOT−23 Surface Mount

mount plastic SOT−23 package. These devices are designed to provide

voltage regulation with minimum space requirement. They are well

suited for applications such as cellular phones, hand held portables,

and high density PC boards.

Specification Features



Mechanical Characteristics

CASE:

FINISH:

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

POLARITY:

FLAMMABILITY RATING:

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Nonrepetitive current pulse per Figure 9.

2. FR−5 = 1.0 X 0.75 X 0.62 in.

3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.

*For additional information on our Pb−Free strategy and soldering details, please

MAXIMUM RATINGS

 Semiconductor Components Industries, LLC, 2012

January, 2012 − Rev. 8

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Peak Power Dissipation @ 20 ms (Note 1)

@ T

Total Power Dissipation on FR−5 Board,

Thermal Resistance, Junction−to−Ambient

Total Power Dissipation on Alumina

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature Range

This series of Zener diodes is offered in the convenient, surface

260C for 10 Seconds

Site and Control Change Requirements

225 mW Rating on FR−4 or FR−5 Board

Zener Breakdown Voltage Range − 2.4 V to 75 V

Package Designed for Optimal Automated Board Assembly

Small Package Size for High Density Applications

ESD Rating of Class 3 (> 16 kV) per Human Body Model

Peak Power − 225 W (8

AEC−Q101 Qualified and PPAP Capable

SZ Prefix for Automotive and Other Applications Requiring Unique

Pb−Free Packages are Available*

(Note 2) @ T

Derated above 25C

Substrate, (Note 3) @ T

Derated above 25C

 25C

Void-free, transfer-molded, thermosetting plastic case

Corrosion resistant finish, easily solderable

Cathode indicated by polarity band

= 25C

Rating

= 25C

UL 94 V−0

20 ms)

Symbol

, T

qJA

stg

−65 to

+150

Max

225

556

300

417

1.8

2.4

mW/C

C/W

Unit

C

BZX84CxxxET1G

SZBZX84CxxxET1G

BZX84CxxxET3G

SZBZX84CxxxET3G

†For information on tape and reel specifications,

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

*Date Code orientation may vary depending

upon manufacturing location.

(Note: Microdot may be in either location)

DEVICE MARKING INFORMATION

Device

Cathode

ORDERING INFORMATION

xxx

MARKING DIAGRAM

http://onsemi.com

= Device Code

= Date Code*

= Pb−Free Package

CASE 318

STYLE 8

SOT−23

xxx M G

(Pb−Free)

Package

SOT−23

Publication Order Number:

BZX84C2V4ET1/D

Anode

Tape & Reel

Shipping

10,000 /

3,000 /

†

Related parts for BZX84C36ET1

BZX84C36ET1 Summary of contents

Page 1

... Nonrepetitive current pulse per Figure 9. 2. FR−5 = 1.0 X 0.75 X 0.62 in. 3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.  Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 8 *Date Code orientation may vary depending upon manufacturing location ...

Page 2

ELECTRICAL CHARACTERISTICS (Pinout: 1-Anode, 2-No Connection, 3-Cathode) (T unless otherwise noted 0.90 V Max Symbol Parameter V Reverse Zener Voltage @ Reverse Current ZT Z Maximum Zener Impedance @ I ZT ...

Page 3

... BZX84C24ET1G BC8 22 Below ZT1 Device Min Nom Device* Marking BZX84C27ET1G BC9 25.1 27 BZX84C30ET1G BD1 28 30 BZX84C33ET1G BD2 31 33 BZX84C36ET1G BD3 34 36 BZX84C39ET1G BD4 37 39 BZX84C43ET1G BK6 40 43 BZX84C47ET1G BD5 44 47 BZX84C51ET1G BD6 48 51 BZX84C56ET1G BD7 52 56 BZX84C62ET1G BD8 58 62 ...

Page 4

TYPICAL T VALUES −1 −2 − NOMINAL ZENER VOLTAGE (V) Z Figure 1. Temperature Coefficients (Temperature Range − 55C to +150C) 1000 ...

Page 5

V BIAS 1 V BIAS 100 BIAS AT 50 NOM NOMINAL ZENER VOLTAGE (V) Z Figure 5. Typical Capacitance 100 10 1 0.1 0. ...

Page 6

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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