AT24C256C-XHL-B Atmel, AT24C256C-XHL-B Datasheet

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... JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN and 8-ball VFBGA Packages • Die Sales: Wafer Form, Waffle Pack and Bumped Wafers Description The AT24C256C provides 262,144-bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 32,768 words of eight bits each. The device’s cascadable feature allows up to eight devices to share a common two-wire bus ...

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... Respect to Ground ............................... − 1.0 V +7.0V Maximum Operating Voltage ................................... 6.25V DC Output Current ................................................ 5.0 mA Figure 1-1. Block Diagram V CC GND WP SCL SDA Atmel AT24C256C 2 *NOTICE: Stresses beyond those listed under “Absolute START STOP LOGIC SERIAL CONTROL LOGIC LOAD COMP DEVICE ADDRESS LOAD INC COMPARATOR R/W ...

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... Atmel recommends using 10kΩ or less. 8568C–SEEPR–5/10 ) for compatibility with other Atmel CC “Device Addressing”) A device is selected when a corresponding hardware and software , all write operations to the memory are inhibited. If the pin is left floating, the WP CC Atmel AT24C256C ® AT24Cxx devices. When the pins are 3 ...

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... Memory Organization Atmel AT24C256C, 256K SERIAL EEPROM: The 256K is internally organized as 512 pages of 64-bytes each. Random word addressing requires a 15-bit data word address. Table 3-1. Pin Capacitance Applicable over recommended operating range from 25° 1.0MHz, V Symbol C Input/Output Capacitance (SDA) I/O C Input Capacitance (A0, A1, SCL) ...

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... Input and output timing reference voltages: 0.5V 8568C–SEEPR–5/10 = +1.7V to +5.5V 100 pF (unless otherwise noted). Parameter (1) (1) (1) ): 1.3kΩ (2.5V, 5.5V), 10kΩ (1.7V 0. Atmel AT24C256C Test conditions are listed in Note 2. 1.7V 2.5, 5.0V Min Max Min Max 400 1000 1.3 0.4 0.6 ...

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... The EEPROM sends a “0” during the ninth clock cycle to acknowledge that it has received each word. STANDBY MODE: The Atmel and after the receipt of the stop bit and the completion of any internal operations. Atmel AT24C256C 6 DATA STABLE DATA CHANGE ® AT24C256C features a low-power standby mode that is enabled upon power-up P 8568C–SEEPR–5/10 ...

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... The device is ready for next communication after above steps has been completed. Figure 4-3. Software Reset Start bit SCL 1 SDA Figure 4-4. Bus Timing SCL t SU.STA SDA IN SDA OUT 8568C–SEEPR–5/10 Dummy Clock Cycles HIGH LOW LOW HD.STA HD.DAT SU.DAT Atmel AT24C256C Start bit Stop bit SU.STO t BUF 7 ...

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... Write Cycle Timing SCL SDA 8th BIT WORDn Note: 1. The write cycle time t the internal clear/write cycle Figure 4-6. Output Acknowledge 1 SCL DATA IN DATA OUT Atmel AT24C256C 8 ACK ( STOP CONDITION is the time from a valid stop condition of a write sequence to the end ...

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... Upon a compare of the device address, the EEPROM will output a “0” compare is not made, the device will return to a standby state. DATA SECURITY: The Atmel protect the whole memory when the WP pin 8568C–SEEPR–5/ R/W LSB ® AT24C256C has a hardware data protection scheme that allows the user to write . CC Atmel AT24C256C 9 ...

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... This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a “0”, allowing the read or write sequence to continue. Atmel AT24C256C the nonvolatile memory. All inputs are disabled during this WR 8568C– ...

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... The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a “0” but does generate a following stop condition. (Refer to Figure 12) Figure 7-2. Random Read Note DON’T CARE bit 8568C–SEEPR–5/10 Atmel AT24C256C 11 ...

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... When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a “0” but does generate a following stop condition (refer to Figure 13). Figure 7-3. Sequential Read Atmel AT24C256C 12 8568C–SEEPR–5/10 ...

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... Ordering Code Detail Atmel Designator Product Family Device Density 256 = 256K Device Revision 8568C–SEEPR–5/ Atmel AT24C256C Shipping Carrier Option B or blank = Bulk (tubes Tape and re el Operating Voltage L = 1.7V to 5.5V Package Device Grade or Wafer/Die Thickness H = Green, NiPdAu lead finish, Industrial Temperature Range (-40° ...

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... E C |---|---|---|---|---| Bottom Mark |---|---|---|---|---|---|---| X X |---|---|---|---|---|---|---| <- PIN 1 INDICATOR Atmel AT24C256C-MAHL Top Mark |---|---|---|---|---|---|---|---| |---|---|---|---|---|---|---|---| |---|---|---|---|---|---|---|---| * | PIN 1 INDICATOR (DOT) Atmel AT24C256C 14 Seal Year | Seal Week Y = SEAL YEAR | | | 6: 2006 7: 2007 2008 9: 2009 L Lot Number to Use ALL Characters in Marking BOTTOM MARK Y = SEAL YEAR 6: 2006 7: 2007 2008 9: 2009 Country of Origin ...

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... Y = ONE DIGIT YEAR CODE 4: 2004 7: 2007 5: 2005 8: 2008 6: 2006 9: 2009 M = SEAL MONTH (USE ALPHA DESIGNATOR A- JANUARY B = FEBRUARY " " """""""" OCTOBER K = NOVEMBER L = DECEMBER TC = TRACE CODE 8568C–SEEPR–5/10 2ECU YMTC | <--- PIN 1 INDICATOR (DOT) Atmel AT24C256C 15 ...

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... Ordering Codes Atmel AT24C256C Ordering Information Ordering Code (1) AT24C256C-SSHL-B (2) AT24C256C-SSHL-T (1) AT24C256C-XHL-B (2) AT24C256C-XHL-T (2) AT24C256C-MAHL-T (2) AT24C256C-CUL-T (3) AT24C256C-WWU11L Note: 1. Bulk delivery in tubes (SOIC and TSSOP 100/tube) 2. Tape and reel delivery (SOIC 4k/reel, TSSOP, UDFN and VFBGA 5k/reel) 3. Contact Atmel Sales for Wafer sales 8S1 8-lead, 0.150” ...

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... Package Drawing Contact: packagedrawings@atmel.com 8568C–SEEPR–5/10 SYMBOL TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) Atmel AT24C256C END VIEW COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX NOTE 1.35 – 1.75 0.10 – 0.25 0.31 – ...

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... Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and determined at Datum Plane H. Package Drawing Contact: packagedrawings@atmel.com Atmel AT24C256C TITLE 8A2, 8-lead 4 ...

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... E2 1 Pin (R0.10) 0. MO-229 for proper dimensions, TITLE 8MA2, 8-pad 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) Atmel AT24C256C C COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D 2.00 BSC E 3.00 BSC 1.60 D2 1.40 1.50 E2 1.20 1 ...

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... VFBGA A1 Ball Pad Corner A1 BALL PAD CORNER e (e1) Notes: 1. This drawing is for general information. 2. Dimension 'b' is measured at the maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. Package Drawing Contact: packagedrawings@atmel.com Atmel AT24C256C 20 0.10 (4X Top View (d1) Bottom View ...

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... Revision History Appendix A. Doc. Rev. Date 8568C 05/2010 8568B 03/2010 8568A 09/2009 8568C–SEEPR–5/10 Update 8S1 and 8A2 package drawings. Part Markings and ordering detail/codes updated. Initial document release Atmel AT24C256C Comments 21 ...

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