ADA4817-1ARD-EBZ Analog Devices, ADA4817-1ARD-EBZ Datasheet - Page 2

• Manufacturer Part Number: ADA4817-1ARD-EBZ
• Description: Amplifier IC Development Tools ADA4817-1AR-EBZ_A00973_EB-O8REDF-1Z
• Manufacturer: Analog Devices
• Type: High Speed Amplifiersr
• Series: ADA4817r

Specifications of ADA4817-1ARD-EBZ

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: ADA4817-1ARDZ
• Operating Supply Voltage: 5 V to 10 V
• Description/function: 8 lead SOIC bare evaluation board
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 19 mA
• Factory Pack Quantity: 1
• For Use With: ADA4817

ADA4817-1/ADA4817-2
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Connection Diagrams ...................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 8
Test Circuits ..................................................................................... 13
Theory of Operation ...................................................................... 14
REVISION HISTORY
5/13—Rev. A to Rev. B
Changes to Figure 3 .......................................................................... 1
Changes to Figure 7 .......................................................................... 7
Updated Outline Dimensions ....................................................... 24
Changes to Ordering Guide .......................................................... 25
3/09—Rev. 0 to Rev. A
Added 8-Lead SOIC Package ............................................ Universal
Changes to Features Section and General Description Section . 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 4
Changes to Figure 4 .......................................................................... 5
Changes to Figure 9, Figure 11, and Figure 12 ............................. 8
Changes to Figure 21, Figure 22, and Figure 24 ......................... 10
Changes to Figure 33 ...................................................................... 12
Added Figure 34; Renumbered Sequentially .............................. 12
Changes to Thermal Considerations Section and Power-Down
Operation Section ........................................................................... 15
Changes to Capacitive Feedback Section and Figure 46 ........... 16
Added Higher Frequency Attenuation Section, Figure 47,
Figure 48, and Figure 49; Renumbered Sequentially ................. 16
Updated Outline Dimensions ....................................................... 24
Changes to Ordering Guide .......................................................... 25
11/08—Revision 0: Initial Version
±5 V Operation ............................................................................. 3
5 V Operation ............................................................................... 4
Thermal Resistance ...................................................................... 5
Maximum Safe Power Dissipation ............................................. 5
ESD Caution .................................................................................. 5
Closed-Loop Frequency Response ........................................... 14
Noninverting Closed-Loop Frequency Response .................. 14
Inverting Closed-Loop Frequency Response ............................. 14
Wideband Operation ................................................................. 15
Rev. B | Page 2 of 28
Layout, Grounding, and Bypassing Considerations .................. 17
Applications Information .............................................................. 19
Outline Dimensions ....................................................................... 24
Driving Capacitive Loads .......................................................... 15
Thermal Considerations ............................................................ 15
Power-Down Operation ............................................................ 15
Capacitive Feedback ................................................................... 16
Higher Frequency Attenuation ................................................. 16
Signal Routing ............................................................................. 17
Power Supply Bypassing ............................................................ 17
Grounding ................................................................................... 17
Exposed Paddle........................................................................... 17
Leakage Currents ........................................................................ 18
Input Capacitance ...................................................................... 18
Input-to-Input/Output Coupling ............................................. 18
Low Distortion Pinout ............................................................... 19
Wideband Photodiode Preamp ................................................ 19
High Speed JFET Input Instrumentation Amplifier.............. 21
Active Low-Pass Filter (LPF) .................................................... 22
Ordering Guide .......................................................................... 25
Data Sheet