AD6657AEBZ Analog Devices, AD6657AEBZ Datasheet - Page 11

• Manufacturer Part Number: AD6657AEBZ
• Description: Data Conversion IC Development Tools 11 Bit 200 Msps Quad IF Receiver
• Manufacturer: Analog Devices
• Type: ADCr
• Series: AD6657Ar

Specifications of AD6657AEBZ

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: AD6657A
• Interface Type: SPI, USB
• Operating Supply Voltage: 6 V
• Description/function: Quad IF receiver with noise shaping requantizer
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 2 A
• Factory Pack Quantity: 1
• For Use With: HSC-ADC-EVALCZ

Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD to AGND
DRVDD to AGND
VIN+x, VIN−x to AGND
CLK+, CLK− to AGND
SYNC to AGND
VCMx to AGND
CSB to AGND
SCLK to AGND
SDIO to AGND
PDWN to AGND
MODE to AGND
Digital Outputs to AGND
DCO+AB, DCO−AB, DCO+CD,
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DCO−CD to AGND
(Ambient)
Under Bias
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−40°C to +85°C
150°C
−65°C to +150°C
Rev. 0 | Page 11 of 36
THERMAL CHARACTERISTICS
The values in Table 7 are per JEDEC JESD51-7 and JEDEC
JESD25-5 for a 2S2P test board. Typical θ
4-layer printed circuit board (PCB) with a solid ground plane.
As shown in Table 7, airflow improves heat dissipation, which
reduces θ
package leads from metal traces, through holes, ground, and
power planes reduces θ
Table 7.
Package Type
144-Ball CSP_BGA
1
2
3
The values in Table 8 are from simulations. The PCB is a JEDEC
multilayer board. Thermal performance for actual applications
requires careful inspection of the conditions in the application
to determine whether they are similar to those assumed in these
calculations.
Table 8.
Package Type
144-Ball CSP_BGA
ESD CAUTION
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-STD 883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
JA
. In addition, metal in direct contact with the
Airflow
Velocity
0 m/s
1 m/s
2.5 m/s
Airflow
Velocity
0 m/s
1 m/s
2.5 m/s
JA
.
θ
26.9
24.2
23.0
JA
1

14.4
14.0
13.9
JB
JA
θ
8.9
is specified for a
JC
2

0.23
0.50
0.53
AD6657A
JT
θ
6.6
JB
3
Unit
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W