AT24C1024B-PU25 Atmel, AT24C1024B-PU25 Datasheet - Page 13

• Manufacturer Part Number: AT24C1024B-PU25
• Description: IC EEPROM 1MBIT 1MHZ 8DIP
• Manufacturer: Atmel

Specifications of AT24C1024B-PU25

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1M (128K x 8)
• Speed: 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Organization: 128 K x 8
• Interface Type: 2-Wire
• Maximum Clock Frequency: 1 MHz
• Access Time: 550 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Current: 3 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V, 5 V
• Memory Configuration: 131072 X 8
• Clock Frequency: 1MHz
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
Notes:
5194F–SEEPR–1/08
8P3
8S1
8S2
8A2
8Y7
8U4-1
–1.8
–2.5
Ordering Code
AT24C1024B-PU (Bulk form only)
AT24C1024B-PU25 (Bulk form only)
AT24C1024BN-SH-B
AT24C1024BN-SH-T
AT24C1024BN-SH25-B
AT24C1024BN-SH25-T
AT24C1024BW-SH-B
AT24C1024BW-SH-T
AT24C1024BW-SH25-B
AT24C1024BW-SH25-T
AT24C1024B-TH-B
AT24C1024B-TH-T
AT24C1024B-TH25-B
AT24C1024B-TH25-T
AT24C1024BY7-YH-T
AT24C1024BY7-YH25-T
AT24C1024BU4-UU-T
AT24C1024B-W-11
1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200” Wide Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (1.8V to 3.6V)
Low-voltage (2.5V to 5.5V)
(2)
(3)
(1)
(2)
(1)
(2)
(1)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(2)
(2)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Options
1.8
2.5
1.8
2.5
2.5
1.8
Voltage
1.8
2.5
1.8
2.5
1.8
2.5
1.8
1.8
2.5
2.5
1.8
1.8
Package
Die Sale
8U4-1
8S1
8S1
8S1
8S2
8S2
8S2
8A2
8A2
8A2
8A2
8Y7
8P3
8P3
8S1
8S2
8Y7
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
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