ADP1614-650-EVALZ Analog Devices, ADP1614-650-EVALZ Datasheet - Page 15

• Manufacturer Part Number: ADP1614-650-EVALZ
• Description: Power Management IC Development Tools Eval Board 650 kHz Switching Freq
• Manufacturer: Analog Devices
• Type: DC/DC Converters, Regulators & Controllersr
• Series: ADP1614r

Specifications of ADP1614-650-EVALZ

• Rohs: yes
• Tool Is For Evaluation Of: ADP1614
• Input Voltage: 2.5 V to 5.5 V
• Factory Pack Quantity: 1

Data Sheet
PCB LAYOUT GUIDELINES
For high efficiency, good regulation, and stability, a well designed
PCB layout is required.
Use the following guidelines when designing PCBs (see Figure 25
for a block diagram and Figure 2 for a pin configuration).
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•
•
•
•
•
•
•
•
Avoid routing high impedance traces from the compensation
and feedback resistors near any node connected to SW or near
the inductor to prevent radiated noise injection.
Keep the low ESR input capacitor (C
C4 in Figure 28, close to VIN and GND. This minimizes
noise injected into the part from board parasitic inductance.
Keep the high current path from C
to SW and GND as short as possible.
Keep the high current path from VIN through the inductor
(L1), the rectifier (D1), and the output capacitor (C
which is labeled as C7 in Figure 28, as short as possible.
Keep high current traces as short and as wide as possible.
Place the feedback resistors as close to FB as possible to
prevent noise pickup. Connect the ground of the feedback
network directly to an AGND plane that makes a Kelvin
connection to the GND pin.
Place the compensation components as close as possible to
COMP. Connect the ground of the compensation network
directly to an AGND plane that makes a Kelvin connection
to the GND pin.
Connect the soft start capacitor (C
C1 in Figure 28, as close as possible to the device. Connect
the ground of the soft start capacitor to an AGND plane
that makes a Kelvin connection to the GND pin.
Connect the current limit set resistor (R
labeled as R4 in Figure 28, as close as possible to the device.
Connect the ground of the CL resistor to an AGND plane
that makes a Kelvin connection to the GND pin.
The PCB must be properly designed to conduct the heat
away from the package. This is achieved by adding thermal
vias to the PCB, which provide a thermal path to the inner
or bottom layers. Thermal vias should be placed on the
PCB underneath the exposed pad of the LFCSP and in the
GND plane around the
thermal performance of the package.
ADP1614
IN
package to improve
SS
through the L1 inductor
), which is labeled as
IN
), which is labeled as
CL
), which is
OUT
),
Rev. 0 | Page 15 of 16
Figure 28.
Figure 29.
ADP1614
ADP1614
Recommended Bottom Layer Layout for Boost Application
Recommended Top Layer Layout for Boost Application
ADP1614