88-00150-85 Murata Wireless Solutions, 88-00150-85 Datasheet

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Bluetooth Class 1 Module Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed ...

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Revision History Revision Date 0.1 Jul-07-2011 0.5 Nov-15-2011 0.6 Jan-05-2012 0.61 Jan-31-2012 0.62 Apr-10-2012 0.63 May-22-2012 1.0 Aug 10 SyChip/Murata Confidential Author Release the first datasheet. N. Nagayama Update the block diagram / BT IC product number Update the SyChip ...

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... M L ............................................................................................................................................. 19 ODULE OCATION 6.2.1 Location in x-y plane ............................................................................................................................... 19 6.2.2 Location in z-plane .................................................................................................................................. 20 7 SOFTWARE ........................................................................................................................................................... 21 7 OFTWARE RCHITECTURE 7 LUETOOTH ROFILE TACKS 8 DEVELOPMENT TOOLS .................................................................................................................................... 22 9 ASSEMBLY INFORMATION ............................................................................................................................. 23 9 EAD FREE SOLDERING REFLOW PROFILE 10 PACKAGING AND MARKING INFORMATION ............................................................................................ 24 10 ARRIER APE IMENSIONS 10 ODULE ARKING NFORMATION 11 ORDERING INFORMATION ............................................................................................................................. 25 12 ROHS DECLARATION ...

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...................................................................................................................................... 26 OTICE ANADA 13 ABELING EQUIREMENTS 13 ...................................................................................................................................... 27 OTICE UROPE 13 ABELING EQUIREMENTS 14 TECHNICAL SUPPORT CONTACT ................................................................................................................. 28 15 DISCLAIMER ......................................................................................................................................................... 28 ...

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F 1 SN2100 M B IGURE ODULE LOCK IGURE ODULE OP AND IDE ..................................................................................................................................... 9 IGURE ODULE OTTOM IEW IGURE ETAILED ECHANICAL F 5 ...

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System Descriptions 1.1 Applications SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with on- board antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO and chip antenna into a small LGA ...

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Block Diagram SyChip/Murata Confidential Figure 1 SN2100 Module Block Diagram Page SN2100 Datasheet Ver. 1.0 ...

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Mechanical Specifications 2.1 Module Dimension Parameter Dimension (LxWxH) Dimension tolerances (LxWxH) 2.2 Module top and side view SyChip/Murata Confidential Typical 17.5 x 16.0 x 2.0 +/- 0.2 mm Figure 2 Module Top and Side View Page ...

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Module bottom view SyChip/Murata Confidential Figure 3 Module Bottom View Page SN2100 Datasheet Ver. 1.0 ...

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Detailed mechanical data (top view) Figure 4 Detailed Mechanical Data (top view) SyChip/Murata Confidential Page SN2100 Datasheet Ver. 1.0 ...

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Module Pin-out Pin # Pin name 1 GND 2 VIN 3 Reserved 4 HCI_CTS 5 HCI_TX 6 HCI_RTS 7 HCI_RX 8 nRESET 9 GND 10 AUD_IN 11 AUD_OUT 12 AUD_CLK 13 AUD_SYNC 14 GND 15 GND 16 GND 17 ...

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Pin # Pin name 29 GND 30 GND 31 GND 32 GND SyChip/Murata Confidential I/O Description - Ground - Ground - Ground - Ground Page SN2100 Datasheet Ver. 1.0 ...

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DC Electrical Specifications 3.1 Typical Power Consumption Item Standby mode (after VIN = 3.0V, TEMP = 25° C send script) TX maximum current VIN = 3.0V, TEMP = 25° maximum current VIN = 3.0V, TEMP = 25° ...

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RF Specifications 4.1 Bluetooth Specification Parameter Bluetooth Specification Channel Spacing The number of channel Power Class 4.2 RF Characteristics (TX) VIN = 3.0V, TEMP = 25° terminal load connected to the RF connector Parameter Output Power ...

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EIRP. SyChip/Murata Confidential Page SN2100 Datasheet Ver. 1.0 ...

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RF Characteristics (RX) VIN = 3.0V, TEMP = 25° terminal load connected to the RF connector Parameter Sensitivity (BER <= 0.1%) C/I Performance (BER <= 0.1%) Co-channel ratio (-60 dBm input) 1MHz ratio (-60dBm input) 2MHz ...

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Environmental Specifications 5.1 Absolute maximum ratings Symbol Operating temperature T op Storage temperature T st VIN Power supply MSL Moisture Sensitivity Level RoHS Restriction of Hazardous Substances 5.2 Operation conditions Symbol Parameter VIN Power supply Operating temperature T op ...

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Application Information 6.1 Host PCB layout recommendations The SN3020 module has an onboard antenna therefore it requires some special host PCB layout underneath the module such that the radio can achieve its best RF performance. Refer to Figure 5 ...

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Module Location For optimum EIRP, customer is advised to use the recommended module location on their respective PCB. 6.2.1 Location in x-y plane Antenna Connector Antenna Shield Case Figure 6 Recommended Locations in xy-plane Figure 7 Locations Not Recommended ...

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Location in z-plane Module Figure 8 Recommended Locations in z-plane Metal Figure 9 Locations Not Recommended in xy-plane SyChip/Murata Confidential Metal Antenna Connector Mother Board Metal Metal Page Antenna Metal SN2100 Datasheet Ver. 1.0 ...

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Software 7.1 Software Architecture SN2100 module communicates with host processor via HCI interface. The HCI interface transports commands, events, ACL, and synchronous data between the device and the host using HCI data packets. The Bluetooth profile stack beyond HCI ...

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... Development Tools SN2100 EM Development Kit is offered for customer application development on Texas Instruments MSP430 and Stellaris® platform. The table below lists the related tools that the customer may need. Tool Description 1 88-00150-85 SN2100 EM Development Kit 2 TI MSP- MSP430 Experimenter Board EXP430F5438 3 ...

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Assembly Information 9.1 Lead-free soldering reflow profile The lead-free solder reflow profile is recommended in the table & graph below. The profile is used to attach the module to its host PCB. The module is designed to withstand 2 ...

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Packaging and Marking Information 10.1 Carrier Tape Dimensions 10.2 Module Marking Information The following marking information may be printed on a permanent label affixed to the module shield or permanently laser written into the module shield itself. The 2D ...

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... SyChip/Murata Confidential Table 11 Ordering Information SyChip Model SyChip Part Number Number SN2100EMK 88-0150-85 SN2100 88-0150-00 Page Standard Order Increment 1 pc 500 pcs SN2100 Datasheet Ver. 1.0 ...

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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential ...

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This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of ...

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... Plano, TX 75093 USA Tel: (972) 202-8900 Fax: (972) 633-0327 Note: SyChip, LLC is an operating unit within Murata Wireless Solutions 15 Disclaimer Please read this notice before using the SN2100 product. 1. Please note that the only warranty that SyChip LLC (“SyChip”) provides regarding the products is its conformance to the specifications provided herein ...

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... Since the application of static electricity or overvoltage may cause a defect in the product or deterioration of its reliability, caution must be taken against exposure to any static electricity generated by electrified items such as work benches, soldering irons, tools, carrying containers, etc. iv) Caution shall be taken to avoid overstress to the product during and after the soldering process ...

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Repaired products shall be warranted for the remainder of the original warranty period. Replaced products shall be warranted for a new full warranty period. For avoidance of doubt, SyChip shall not be liable for any defects that are caused ...