EN5339QI-E Enpirion, EN5339QI-E Datasheet - Page 15

• Manufacturer Part Number: EN5339QI-E
• Description: Power Management IC Development Tools EN5339QI EVAL BOARD
• Manufacturer: Enpirion
• Type: DC/DC Converters, Regulators & Controllersr

Specifications of EN5339QI-E

• Product Category: Power Management IC Development Tools
• Product: Evaluation Boards
• Tool Is For Evaluation Of: EN5339QI
• Input Voltage: 2.4 V to 5.5 V
• Output Voltage: 0.6 V
• Output Current: 3 A

Design Considerations for Lead
Design Considerations for Lead-Frame Based Modules
Exposed Metal Pads on Package Bottom
Exposed Metal Pads on Package Bottom
QFN lead-frame based package technology utilizes exposed metal pads on the bottom of the package that
provide improved thermal dissipation,
thickness, larger lead size and pitch, and excellent lead co
integrated module consisting of multiple internal devices, the lead
integrated module consisting of multiple internal devices, the lead-frame provides circuit interconnection and
mechanical support of these devices resulting in multiple
mechanical support of these devices resulting in multiple exposed metal pads on the package bottom.
Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the
Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the
Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the
PCB through a SMT soldering process. All other exposed metal is to remain free of any inte
PCB through a SMT soldering process. All other exposed metal is to remain free of any inte
PCB through a SMT soldering process. All other exposed metal is to remain free of any interconnection to the
PCB. Figure 7 shows the recommended PCB metal layout for the EN5339 package. A GND pad with a solder
mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.
mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.
mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.
The PCB should be clear of any other met
The PCB should be clear of any other metal, including traces, vias, etc., under the package to avoid electrical
shorting.
The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from
The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from
The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from
causing bridging between adjacent pins or other exposed metal u
causing bridging between adjacent pins or other exposed metal under the package. Please consult the
Enpirion Manufacturing Application Note for more details and recommendations.
Enpirion Manufacturing Application Note for more details and recommendations.
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Grey area highlights exposed metal that is not to be mechanically or electrically co
Grey area highlights exposed metal that is not to be mechanically or electrically connected to the PCB.
frame based package technology utilizes exposed metal pads on the bottom of the package that
frame based package technology utilizes exposed metal pads on the bottom of the package that
shows the recommended PCB metal layout for the EN5339 package. A GND pad with a solder
shows the recommended PCB metal layout for the EN5339 package. A GND pad with a solder
lead size and pitch, and excellent lead co-planarity. As the EN5339 package is a fully
Figure 7. Recommended Footprint for PCB (Top View)
Figure 7. Recommended Footprint for PCB (Top View)
, lower package thermal resistance, smaller package footprint and
al, including traces, vias, etc., under the package to avoid electrical
package thermal resistance, smaller package footprint and
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exposed metal pads on the package bottom.
frame provides circuit interconnection and
nder the package. Please consult the
As the EN5339 package is a fully
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nnected to the PCB.
EN5339QI