MT48LC16M16A2P-6A:D TR Micron Technology Inc, MT48LC16M16A2P-6A:D TR Datasheet - Page 18
![IC SDRAM 256MBIT 167MHZ 54TSOP](/photos/7/22/72261/557-54-tsop_sml.jpg)
MT48LC16M16A2P-6A:D TR
Manufacturer Part Number
MT48LC16M16A2P-6A:D TR
Description
IC SDRAM 256MBIT 167MHZ 54TSOP
Manufacturer
Micron Technology Inc
Datasheet
1.MT48LC16M16A2P-75D_TR.pdf
(92 pages)
Specifications of MT48LC16M16A2P-6A:D TR
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (16Mx16)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1223-2
MT48LC16M16A2P-6A:D TR
MT48LC16M16A2P-6A:D TR
- Current page: 18 of 92
- Download datasheet (3Mb)
Figure 9: 54-Ball VFBGA "FG" (8mm x 14mm) (x16)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
SEATING PLANE
54X Ø0.45
6.40
0.10 C
3.20 ±0.05
BALL A9
Notes:
C
0.65 ±0.05
3.20 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.065mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
0.80 TYP
BALL A1
0.80 TYP
7.00 ±0.05
BALL A1 ID
18
14.00 ±0.10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.00 MAX
256Mb: x4, x8, x16 SDRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø 0.40
Package Dimensions
© 1999 Micron Technology, Inc. All rights reserved.
BALL A1 ID
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