MAX15112EVKIT# Maxim Integrated, MAX15112EVKIT# Datasheet - Page 21

• Manufacturer Part Number: MAX15112EVKIT#
• Description: Power Management IC Development Tools MAX15112 Eval Kit
• Manufacturer: Maxim Integrated
• Type: Power Switchesr
• Series: MAX15112r

Specifications of MAX15112EVKIT#

• Rohs: yes
• Product: Evaluation Kits
• Tool Is For Evaluation Of: MAX15112
• Input Voltage: 2.7 V to 5.5 V
• Output Voltage: 0.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Output Current: 12 A
• For Use With: MAX15112

The MAX15112 is available in a 24-bump WLP package
and can dissipate up to 2.15W at +70NC board tem-
perature. When the die temperature exceeds +150NC,
the thermal shut down protection is activated (see the
Thermal Shutdown Protection
Careful PCB layout is critical to achieve clean and stable
operation. It is highly recommended to duplicate the
MAX15112 Evaluation Kit layout for optimum perfor-
mance. The MAX15112 EV kit board has a small, quiet,
ground-shape SGND on the back side below the IC. This
ground is the return for the control circuitry, especially
the return of the compensation components. This SGND
is returned to the IC ground through vias close to the
ground bumps of the IC. If deviation is necessary, follow
these guidelines for good PCB layout:
1) Connect a single ground plane immediately adjacent
2) Place capacitors on IN and SS/REFIN as close as
3) Keep the high-current paths as short and wide as
4) An electrolytic capacitor is strongly recommended for
5) Connect IN, LX, and GND separately to a large cop per
to the GND bumps of the IC.
possible to the IC and the corresponding pad using
direct traces.
possible. Keep the path of switching current short
and minimize the loop area formed by LX, the output
capacitors, and the input capacitors.
damping when there is significant distance between
the input power supply and the MAX15112.
area to help cool the IC to further improve efficiency.
High-Efficiency, 12A, Current-Mode Synchronous
Step-Down Regulator with Integrated Switches
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section).
Power Dissipation
Layout Procedure
6) Ensure all feedback connections are short and direct.
7) Route high-speed switching nodes (such as LX and
PROCESS: BiCMOS
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
+Denotes a lead(Pb)-free/RoHS-compliant package.
MAX15112EWG+
PACKAGE
(2.1mm x
3.05mm)
Place the feedback resistors and compensa tion com-
ponents as close as possible to the IC.
BST) away from sensitive analog areas (such as FB
and COMP).
24 WLP
TYPE
PART
W242A3Z+1
PACKAGE
CODE
-40NC to +85NC
TEMP RANGE
Ordering Information
Package Information
OUTLINE
Chip Information
21-0538
MAX15112
NO.
PIN-PACKAGE
PATTERN NO.
Application
Note 1891
24 WLP
Refer to
LAND