MAX17602EVKIT# Maxim Integrated, MAX17602EVKIT# Datasheet - Page 2

• Manufacturer Part Number: MAX17602EVKIT#
• Description: Power Management IC Development Tools MAX17602 Eval Kit
• Manufacturer: Maxim Integrated
• Series: MAX17601?MAX17605r

Specifications of MAX17602EVKIT#

• Rohs: yes

ABSOLUTE MAXIMUM RATINGS
V
OUTA, OUTB to GND ............................................-0.3V to +16V
Junction Operating Temperature Range ......... -40NC to +125NC
Continuous Power Dissipation (T
*As per JEDEC 51 standard.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
SO
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
specified at V
4A Sink /Source Current, 12ns, Dual MOSFET Drivers
POWER SUPPLY (V
V
V
V
V
V
DRIVER OUTPUT (SOURCE) (OUTA, OUTB)
Peak Output Current (Sourcing)
Driver Output Resistance Pulling Up
(Note 4)
DRIVER OUTPUT (SINK) (OUTA, OUTB)
Peak Output Current (Sinking)
Driver Output Resistance Pulling
Down (Note 4)
DD
DD
DD
DD
DD
DD
DD
8-Pin TDFN (derate 23.8mW/NC above +70NC) ........1904mW
8-Pin SO (derate 74mW/NC above +70NC) ............. 588.2mW*
8-Pin FMAX (derate 12.9mW/NC above +70NC) .....1030.9mW
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
, INA, INB, ENA, ENB to GND ........................-0.3V to +16V
Operating Range
Undervoltage Lockout
UVLO Hysteresis
UVLO to OUT_ Delay
Supply Current
= 12V, C
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
DD
L
= 0F, at T
= 4V apply to the TTL versions only.) (Note 2)
DD
)
A
= -40NC to +125NC, unless otherwise noted. Typical values are specified at T
A
= +70NC)
SYMBOL
IDD_SW
IDD_Q
R
R
JC
JC
UVLO
I
I
V
PK-P
PK-N
ON-N
ON-P
DD
) .................8NC/W
) ...............38NC/W
JA
JA
) ..........42NC/W
) ........136NC/W
TTL versions
HNM versions
V
V
Not switching, V
V
switching at 1MHz
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
DD
DD
DD
rising
rising
= 4.5V, C
= 14V, C
= 14V, I
= 4V, I
= 14V, C
= 14V, I
= 4V, I
OUT_
OUT_
OUT_
OUT_
L
L
L
CONDITIONS
= 10nF (Note 3)
= 10nF (Note 3)
DD
= 1nF, both channels
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature ................................................... +150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+240NC
FMAX
= 100mA
= -100mA
= 100mA
= -100mA
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
= 14V (Note 3)
MAX17600–MAX17605
MIN
4
6
3
TYP
0.88
0.91
0.52
200
120
3.5
0.5
12
A
1
4
4
= +25NC. Parameters
JC
) .................5NC/W
JA
MAX
3.85
1.85
1.95
0.95
) .......77.6NC/W
14
14
18
2
1
UNITS
mV
mA
Fs
I
I
A
A
V
V
2