ADP1879-0.3-EVALZ Analog Devices, ADP1879-0.3-EVALZ Datasheet - Page 5

• Manufacturer Part Number: ADP1879-0.3-EVALZ
• Description: Power Management IC Development Tools 300khz Switching Frequency converter
• Manufacturer: Analog Devices
• Series: ADP1879r

Specifications of ADP1879-0.3-EVALZ

• Rohs: yes
• Product: Evaluation Boards
• Factory Pack Quantity: 1

Data
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VREG to PGND, GND
VIN, EN, PGOOD to PGND
FB, COMP, RES, SS to GND
DRVL to PGND
SW to PGND
BST to SW
BST to PGND
DRVH to SW
PGND to GND
PGOOD Input Current
θ
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Maximum Soldering Lead Temperature
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
Stresses a bove those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
JA
4-Layer Board
(10 sec)
(14-Lead LFCSP_WD)
Sheet
−0.3 V to +6 V
±0.3 V
Rating
−0.3 V to +28 V
−0.3 V to (VREG + 0.3 V)
−0.3 V to (VREG + 0.3 V)
−2.0 V to +28 V
−0.6 V to (VREG + 0.3 V)
−0.3 V to +28 V
−0.3 V to VREG
35 mA
30°C/W
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
300°C
Rev. B | Page 5 of 40
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Boundary Condition
In determining the values given in Table 2 and Table 3, natural
convection is used to transfer heat to a 4-layer evaluation board.
Table 3. Thermal Resistance
Package Type
θ
ESD CAUTION
JA
JA
4-Layer Board
is specified for the worst-case conditions, that is, a device
(14-Lead LFCSP_WD)
ADP1878/ADP1879
θ
30
JA
Unit
°C/W