MAX1785EVKIT# Maxim Integrated, MAX1785EVKIT# Datasheet - Page 3

• Manufacturer Part Number: MAX1785EVKIT#
• Description: Power Management IC Development Tools Evaluation kit for MAX1785
• Manufacturer: Maxim Integrated

II. Manufacturing Information
III. Packaging Information
IV. Die Information
Maxim Integrated Products. All rights reserved.
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
Smart Battery-Pack Controller
S4
Texas
ATP Philippines
July 28, 2007
38-pin TSSOP
Copper
100% matte Tin
Conductive Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
#05-9000-2483
Class UL94-V0
Level 3
73°C/W
11°C/W
62.5°C/W
11°C/W
108 X 238 mils
Si
Aluminum/Si (Si = 1%)
None
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide
MAX1785EUU+
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