IS61LV12824-8TQ ISSI, Integrated Silicon Solution Inc, IS61LV12824-8TQ Datasheet - Page 12
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IS61LV12824-8TQ
Manufacturer Part Number
IS61LV12824-8TQ
Description
IC SRAM 3MBIT 8NS 100TQFP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet
1.IS61LV12824-10TQLI-TR.pdf
(13 pages)
Specifications of IS61LV12824-8TQ
Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Memory Size
3M (128K x 24)
Speed
8ns
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS61LV12824-8TQ
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
Company:
Part Number:
IS61LV12824-8TQ-TR
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
PACKAGING INFORMATION
Plastic Ball Grid Array
Package Code: B (119-pin)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. B
02/12/03
Sym.
N0.
Leads
A
A1
A2
A3
A4
b
D
D1
D2
E
E1
E2
e
D
21.80
19.40
13.80
11.90
Min.
0.50
0.80
1.30
0.60
MILLIMETERS
—
20.32 BSC
0.56 BSC
7.62 BSC
1.27 BSC
119
22.20
19.60
14.20
12.10
Max.
2.41
0.70
1.00
1.70
0.90
E2
E
0.858
0.764
0.543
0.469
0.020
0.032
0.051
0.024
Min.
—
A4
0.022 BSC
0.800 BSC
0.300 BSC
0.050 BSC
INCHES
D2
A3
30ϒ
0.874
0.772
0.559
0.476
0.095
0.028
0.039
0.067
0.035
Max.
A2
1-800-379-4774
A
A1
e
Notes:
1. Controlling dimension: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protrusion and
4. Formed leads shall be planar with respect to one another within
should be measured from the bottom of the package.
0.004 inches at the seating plane.
SEATING PLANE
D1
7
6
ISSI
5
E1
4
3 2
φ
b (119X)
1
C
D
G
H
M
N
R
U
A
B
E
F
K
L
P
T
J
®